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As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
TSMC recently held their annual Technology Symposium in Santa Clara, CA. The presentations provided a comprehensive overview of their status and upcoming roadmap, covering all facets of process technology and advanced packaging development. This article will summarize the highlights of the process technology updates… Read More
