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The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis… Read More
Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More
I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More
