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3D Memoriesby Paul McLellan on 09-02-2012 at 4:42 pmCategories: Ansys, Inc., EDA
At DesignCon earlier this year, Tim Hollis of Micron gave an interesting presentation on 3D memories. For sure the first applications of true 3D chips are going to be stacks of memory die and memory on logic. The gains from high bandwidth access to the memory and the physically closer distance from memory to processor are huge.
Micron… Read More
We received some good feedback from our article on Intel’s Back to the Future Buy of Micron and I thought I would present another story line that gives readers a better perspective of what may be possibly coming down the road. In this case, it is the story of AMD and Samsung partnering to counter Intel’s platform play with Micron. The… Read More
In an interview that Gordon Moore gave in early 2000, the former co-founder of Intel recounted how they abandoned the DRAM market in the early 1980s in order to exit the increasingly unprofitable business and focus on the promising, yet still young x86 processor market. Intel was also home to EEPROM and NOR Flash, two memory technologies… Read More