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Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.
The rapid growth of heterogeneous… Read More
Have you ever had the experience where you look up some unusual word in the dictionary since you don’t remember seeing it before. And then, in the next few weeks you keep coming across it. Twice in the last week I have been in presentations about the economics of putting die onto silicon interposers and the possibility of a new… Read More