Analog Bits is aggressively moving to advanced nodes. On SemiWiki, Dan Nenni covered new IP in 3nm at DAC here. I covered the new Analog Bits 3nm IP presented at the TSMC Technology Symposium here. And now, there’s buzz about 2nm IP to be announced at the upcoming TSMC OIP event in September. I was able to get a briefing from the master… Read More
The recent TSMC Technology Symposium in the Bay Area showcased the company’s leadership in areas such as solution platforms, advanced and specialty technologies, 3D enablement and manufacturing excellence. As always, the TSMC ecosystem was an important part of the story as well and that topic is the subject of this post. Analog… Read More
The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
If you’ve designed a chip with analog content (and who hasn’t), you know Analog Bits. Along the way, you likely met Mahesh. If you are a lover of fine wines, you probably know Mahesh quite well. More on that later. I got the opportunity to speak with him recently about what he’s been up to, both now and over the past few years. It’s a story… Read More
In a simple answer – everyone. A keynote presentation “Sensing the Unknowns and Managing Power” by Mahesh Tirupattur, the Executive Vice President at Analog Bits at the recent Siemens User2User conference, discussed the need and application of sensors in computing and power applications. Why sense? As Mahesh explains, sensing… Read More
Dan and Mike are joined by Mahesh Tirupattur, executive vice president at Analog Bits. Mahesh discussed how he found his way to analog IP design and his long association with Analog Bits. Effective strategies for analog IP design and deployment are discussed as well as leading edge applications for analog IP . Mahesh also provides… Read More
As 2020 comes to a close, I hear a lot of chatter about virtual meeting fatigue; “I’m Zoomed out”. We’ve all attended virtual versions of conferences this year with various degrees of success. Overall, I have to say these events are getting better. Semiconductor and EDA folks have a way of adapting and inventing, and it’s showing … Read More
Semiconductor IP is the fastest growing market inside the fabless ecosystem, it always has been and always will be, especially now that non-traditional chip companies are quickly entering the mix. Towards the end of the year I always talk to the ecosystem to see what next year has in store for us and 2018 looks to be another year of … Read More
DesignCon 2014 was very crowded! I have not seen the attendance numbers but as the first conference of the New Year it was very encouraging. The strength of the fabless semiconductor ecosystem is collaboration and face-to-face interactions are the most valuable, absolutely.
The session I moderated was on Mixed Signal Design … Read More
Who’s going to DesignCon next week? I am, absolutely. Dr. Hermann Eul, Vice President & General Manager, Mobile & Communications Group, Intel Corporation will be keynoting on Tuesday. This one I want to hear! Intel missed mobile at 32nm, 22nm, and 14nm. Lets see what they have planned for 10nm. Something good I hope!… Read More
