Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More
(First published December 24, 2014)
A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More
– Intel announced 2 new fabs & New Foundry Services
– Not only do they want to catch TSMC they want to beat them
– It’s a very, very tall order for a company that hasn’t executed
– It will require more than a makeover to get to IDM 2.0
Intel not only wants to catch TSMC but beat them at their own … Read More
