Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More
One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.
On the outside PDF Solutions is a publicly traded semiconductor… Read More
At the 2026 VLSI Symposium, Intel Foundry provided a detailed update on its process technology roadmap, highlighting the continued maturation of Intel 18A, the introduction of Intel 18A-P, and several advanced research initiatives that extend beyond current gate-all-around (GAA) transistor architectures. The presentation… Read More
Stephen Russell: Senior Technical Fellow, TechInsights
Every April, Earth Day prompts a flurry of corporate sustainability pledges and green-tinted press releases. But for the semiconductor industry in 2026, the conversation has moved well past pledges. Carbon accountability is now a procurement requirement, a regulatory… Read More
As semiconductor technology advances into increasingly complex and expensive process nodes, the economic and technical risks associated with ASIC design have grown dramatically. At advanced nodes such as Intel 18A, the cost of a single design error can escalate into tens of millions of dollars, compounded by months of delay.… Read More
The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the most … Read More
The Future Horizons Industry Update Webinar, presented today by Malcolm Penn, provides a comprehensive analysis of the semiconductor industry’s current state and future trajectory. Founded in 1989, Future Horizons leverages over 300 man-years of experience, emphasizing impartial insights from facts (e.g., IMF … Read More
At the recent Hot Chips conference, Intel® unveiled Clearwater Forest, its next-generation Xeon® 6 processor with efficiency cores (E-cores). The unveiling was made by Don Soltis, Xeon Processor Architect and Intel Fellow with over four decades of processor design experience and a long-standing contributor to the Xeon roadmap.… Read More
Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More
Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More
