My first job out of college was migrating a DRAM chip from one process node to a newer node, and it was a 100% manual process that required many months of effort. That need to migrate semiconductor IP to newer nodes is still with us today, and much automation has been applied to digital circuits, however migrating analog IP has proven… Read More
Tag: intel
PDF Solutions AI Executive Conference
Explore the power of ai to transform semiconductor design & manufacturing.
This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI / ML … Read More
Webinar: Hands-On: How Financial Analysts Use AI PCs for Secure Gen AI Workloads
Independent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to the client, businesses can lower SaaS costs, protect user privacy and data security, and enable novel use cases when AI has access to the full set… Read More
Shaping Tomorrow’s Semiconductor Technology IEDM 2024
Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.
Some highlight of this year’s technical program are:
AI – Lots of artificial… Read More
Webinar: Synopsys and Altera, an Intel Company, Present: A Data-Driven Approach to Multi-Die Design Architecture
Abstract:
A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple heterogeneous and homogeneous dies. Disaggregating IPs based on workload demands, selecting the… Read More
Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More
Keysight EDA and Engineering Lifecycle Management at #61DAC
Entering the exhibit area of DAC on the first floor I was immediately faced with the Keysight EDA booth, and it was even larger than either the Synopsys or Cadence booths. They had a complete schedule of partners presenting in their theatre that included: Microsoft Azure, Riscure, Fermi Labs, BAE Systems, Alphawave, Intel Foundry,… Read More
The Chip 4: A Semiconductor Elite
Can a 4-member alliance reshape the semiconductor industry?
Semiconductors are ubiquitous in electronics and computing devices, making them essential to developments in AI, advanced military, and the world economy. As such, it is unquestionable that nations attain considerable … Read More
Why Glass Substrates?
The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More
Intel’s Death Spiral Took Another Turn
Does this justify the widespread Intel bashing?
The latest Intel earnings release was another sharp and deeper turn into the company’s death spiral. On the surface, it is just a whole load of bad news, and the web has been vibrating with Intel bashing since the release.
So what are the facts?
From a revenue perspective, Intel was inside… Read More