The introduction of direct die-to-die bonding technology into high volume production has the potential to substantially affect the evolution of the microelectronics industry. The concerns relative to the “end of Moore’s Law”, the diminishing returns of continued (monolithic) CMOS process scaling, and the disruptive effect… Read More
The introduction of heterogeneous 3DIC packaging technology offers the opportunity for significant increases in circuit density and performance, with corresponding reductions in package footprint. Yet, the implementation of a complex 3DIC product requires a considerable investment in methodology development for all… Read More
This last week the 2020 Symposia on VLSI Technology and Circuits (VLSI Conference) was held as a virtual conference for the first time and it was announced today (June 24th) that this year’s IEDM conference will also be held as a virtual conference.
“The IEDM Executive Committee has decided that in the interest of prioritizing the… Read More
