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The prevailing industry trends are clear: (1) PCB and die package designs are becoming more complex, across both mobile and high-performance applications; (2) communication interface performance between chips (and their related protocols) is increasingly demanding to verify; (3) signal integrity and power integrity issues… Read More
Ground. It’s that little downward-pointing triangle that somehow works miracles on every schematic. It looks very simple until one has to tackle modern power distribution network (PDN) design on a board with high speed and high power draw components, and you soon discover ground is a complicated fairy tale with a lot of influences.… Read More
