TSMC Boston Technology Workshop 2025

TSMC Boston Technology Workshop 2025
by Admin on 03-04-2025 at 8:04 pm

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
  • TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
Read More

TSMC Austin Technology Workshop 2025

TSMC Austin Technology Workshop 2025
by Admin on 03-04-2025 at 8:01 pm

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
  • TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
Read More

TSMC North America Technology Symposium 2025

TSMC North America Technology Symposium 2025
by Admin on 03-04-2025 at 7:59 pm

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
  • TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
Read More

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More


Outlook 2025 with David Hwang of Alchip

Outlook 2025 with David Hwang of Alchip
by Daniel Nenni on 02-17-2025 at 10:00 am

Dave Huang

Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit.  He also serves as Senior Vice President, Business Development.  Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC.  He holds… Read More


2025 Outlook with Oliver Jones of Sondrel

2025 Outlook with Oliver Jones of Sondrel
by Daniel Nenni on 02-10-2025 at 10:00 am

Oliver Jones Sondrel
Ollie is a commercially astute senior leader with over 20 years of experience in strategy, business development and sales across the technology and engineering sectors, with a strong track record in scaling businesses and driving growth. He has held commercial leadership roles in FTSE 100, private equity-backed, and startup
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Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More


Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro

Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro
by Kalar Rajendiran on 10-30-2024 at 10:00 am

Alphawave Using proTeanTechs

As semiconductor technology advances and nodes continue to shrink, designers are faced with increasing challenges related to device complexity, power consumption, and reliability. The delicate balance between high performance, low power usage, and long-term reliability is more critical than ever. This growing demand … Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More