Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit. He also serves as Senior Vice President, Business Development. Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC. He holds… Read More
Tag: hpc
2025 Outlook with Oliver Jones of Sondrel
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More
Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro
As semiconductor technology advances and nodes continue to shrink, designers are faced with increasing challenges related to device complexity, power consumption, and reliability. The delicate balance between high performance, low power usage, and long-term reliability is more critical than ever. This growing demand … Read More
Supercomputing 2024 (SC24)
Program
Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards.
The Program is designed to share best practices in areas such as: algorithms; applications; architectures and networks; clouds and distributed
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
In the rapidly evolving fields of high-performance computing (HPC) and artificial intelligence (AI), reducing time to market is crucial for maintaining competitive advantage. HBM3E systems play a pivotal role in this regard, particularly for hyperscaler and data center infrastructure customers. Alphawave Semi’s… Read More
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More
Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More
Keysight EDA at the 2024 Design Automation Conference
DAC starts June 24th and I can already feel the buzz of excitement building up as I receive updates from EDA vendors like Keysight EDA. Talking with Scott Seiden, Director Strategic Marketing, Keysight EDA Portfolio, I learned that they have the largest booth on the first floor, now that’s a statement that caught my attention. This… Read More