IBM Cloud: Enabling World-Class EDA Workflows

IBM Cloud: Enabling World-Class EDA Workflows
by Admin on 08-02-2025 at 1:00 pm

DAC 62 Systems on Chips

On July 9, 2025, Derren Dunn from IBM Research’s TJ Watson Research Center delivered a DACtv presentation, as seen in the YouTube video detailing IBM’s EDA-as-a-Solution platform. This innovative offering leverages IBM’s high-performance computing (HPC) cloud to deliver hybrid and cloud-only infrastructure for electronic… Read More


AI Evolution and EDA’s Role in the Fourth Wave: William Chappell’s DAC Keynote

AI Evolution and EDA’s Role in the Fourth Wave: William Chappell’s DAC Keynote
by Admin on 08-01-2025 at 12:00 pm

In a keynote at the 62nd Design Automation Conference (DAC) on July 8, 2025, William Chappell, Vice President of Mission Systems at Microsoft, reflected on the intertwined evolution of AI and semiconductor design. Drawing from his DARPA experience, Chappell traced AI’s progression from 2016 onward, highlighting its… Read More


SC25

SC25
by Admin on 07-18-2025 at 11:02 am

The International Conference for High Performance Computing, Networking, Storage, and Analysis

HPC Ignites.

St. Louis is the place to be this fall as the high performance computing community convenes for an exhilarating week of sessions, speakers, and networking at its finest. SC is an unparalleled mix of thousands of scientists,… Read More


Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More


The Sondrel transformation to Aion SIlicon!

The Sondrel transformation to Aion SIlicon!
by Daniel Nenni on 06-20-2025 at 7:00 am

1747740149443

Ollie is a commercially astute senior leader with over 20 years of experience in strategy, business development and sales across the technology and engineering sectors, with a strong track record in scaling businesses and driving growth. He has held commercial leadership roles in FTSE 100, private equity-backed, and startup… Read More


Scaling AI Infrastructure with Next-Gen Interconnects

Scaling AI Infrastructure with Next-Gen Interconnects
by Kalar Rajendiran on 04-29-2025 at 6:00 am

Data Centers Reimagined for Future of Gen AI

At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.

The rapid advancement of artificial intelligence (AI) is fundamentally… Read More


The Growing Importance of PVT Monitoring for Silicon Lifecycle Management

The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
by Kalar Rajendiran on 04-24-2025 at 6:00 am

SLM IP Target Applications

In an era defined by complex chip architectures, ever-shrinking technology nodes and very demanding applications, Silicon Lifecycle Management (SLM) has become a foundational strategy for optimizing performance, reliability, and efficiency across the lifespan of a semiconductor device. Central to effective SLM are Process,… Read More


Design IP Market Increased by All-time-high: 20% in 2024!

Design IP Market Increased by All-time-high: 20% in 2024!
by Eric Esteve on 04-14-2025 at 10:00 am

Top5 License

Design IP revenues achieved $8.5B in 2024 and this is an all-time-high growth of 20%. Wired Interface is still driving Design IP growth with 23.5% but we see the Processor category also growing by 22.4% in 2024. This is consistent with the Top 4 IP companies made of ARM (mostly focused on processor) and a team leading wired interface… Read More


Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More


Outlook 2025 with David Hwang of Alchip

Outlook 2025 with David Hwang of Alchip
by Daniel Nenni on 02-17-2025 at 10:00 am

Dave Huang

Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit.  He also serves as Senior Vice President, Business Development.  Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC.  He holds… Read More