Design IP revenues achieved $8.5B in 2024 and this is an all-time-high growth of 20%. Wired Interface is still driving Design IP growth with 23.5% but we see the Processor category also growing by 22.4% in 2024. This is consistent with the Top 4 IP companies made of ARM (mostly focused on processor) and a team leading wired interface… Read More
Tag: hpc
TSMC Boston Technology Workshop 2025
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
TSMC Austin Technology Workshop 2025
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
TSMC North America Technology Symposium 2025
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
EuroHPC Summit 2025
The EuroHPC Summit 2025 will take place from 18-20 March 2025 at the ICE Congress Centre, in Kraków, Poland.
The EuroHPC Summit is an annual event gathering key European HPC and quantum computing stakeholders from providers to scientific and industrial users, to policy makers.
The Summit is an important moment to showcase the … Read More
Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Outlook 2025 with David Hwang of Alchip
Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit. He also serves as Senior Vice President, Business Development. Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC. He holds… Read More
2025 Outlook with Oliver Jones of Sondrel
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More
Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro
As semiconductor technology advances and nodes continue to shrink, designers are faced with increasing challenges related to device complexity, power consumption, and reliability. The delicate balance between high performance, low power usage, and long-term reliability is more critical than ever. This growing demand … Read More