NanoIC has announced a major expansion of its process design kit portfolio with the introduction of its first A14 logic and embedded eDRAM memory PDK. This milestone reflects the company’s growing role in enabling advanced semiconductor design at cutting-edge technology nodes and addresses increasing industry demand for… Read More
For decades, One-Time Programmable (OTP) memory has been viewed as a foundational element of hardware security. Because OTP can be written only once and cannot be modified afterward, it has traditionally been trusted to store cryptographic keys, secure boot code, device identity, and configuration data. Permanence was often… Read More
Tell us a little bit about yourself and your company.
I have worked in the global semiconductor industry for over 30 years, with major semiconductor companies such as Rambus, AMD and Broadcom, as well as with start-ups such as SCI Semiconductor and DataTrails. I started my career as a digital circuit designer, then moved into marketing,… Read More
HPC, AI, Quantum: Powering Innovation and Sustainability
ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies,
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More
On July 9, 2025, Derren Dunn from IBM Research’s TJ Watson Research Center delivered a DACtv presentation, as seen in the YouTube video detailing IBM’s EDA-as-a-Solution platform. This innovative offering leverages IBM’s high-performance computing (HPC) cloud to deliver hybrid and cloud-only infrastructure for electronic… Read More
In a keynote at the 62nd Design Automation Conference (DAC) on July 8, 2025, William Chappell, Vice President of Mission Systems at Microsoft, reflected on the intertwined evolution of AI and semiconductor design. Drawing from his DARPA experience, Chappell traced AI’s progression from 2016 onward, highlighting its… Read More
HPC Ignites.
St. Louis is the place to be this fall as the high performance computing community convenes for an exhilarating week of sessions, speakers, and networking at its finest. SC is an unparalleled mix of thousands of scientists,… Read More
In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More
Ollie is a commercially astute senior leader with over 20 years of experience in strategy, business development and sales across the technology and engineering sectors, with a strong track record in scaling businesses and driving growth. He has held commercial leadership roles in FTSE 100, private equity-backed, and startup… Read More
