On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More
Strong Overall Market Growth but a Slowdown Looms
After six years of single digit percentage growth in the overall semiconductor market, 2017 saw almost 22% growth and 2018 year-to-date is up roughly 17% (based on numbers published by the world semiconductor trade statistics). The big growth driver the last two years has been … Read More
Intel’s new Tri-Gate technology is causing quite a stir on the stock chat groups. Some have even said if Intel uses its Tri-Gate technology on only Intel processors ARM will be in deep deep trouble. These guys are “Intel Longs” of course and they are battling “Intel Shorts” with cut and paste news clips.
“ARM is in trouble & this… Read More
GLOBALFOUNDRIES showed off its 28nm design ecosystem at #48DAC last week in San Diego. The company featured a full design ecosystem for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) in partnership… Read More
GLOBALFOUNDRIES will show off its 28nm design ecosystem at #48DAC next week in San Diego. The company will feature a full design ecosystem for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) in partnership… Read More
Although there has been always a strong relationship between ARM and GlobalFoundries, it is interesting to notice that Intel has helped to boost it and make it even stronger. Indeed when AMD renegotiated its x86 licensing deal with Intel in 2009, one of the most significant long-term changes was a marked reduction in how much of … Read More
Last week TSMC hosted the2010 Executive Forum on Leading Edge Semiconductor Technology in Yokohama, Japan. The Senior Vice President of R&D at TSMC lectured on process development and the individual technologies for the 45/40nm, 32/28nm and 22/20nm nodes and explained the current status.
Dr. Shang-Yi Chiang joined TSMC… Read More
