Elevating AI with Cutting-Edge HBM4 Technology

Elevating AI with Cutting-Edge HBM4 Technology
by Kalar Rajendiran on 09-30-2024 at 10:00 am

HBM4 Compute Chiplet Subsystem

Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More


Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han

Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han
by Daniel Nenni on 08-09-2024 at 10:00 am

Dan is joined by Dr. Mark Han, Vice President of R&D Engineering for Circuit Simulation at Synopsys. Mark leads a team of over 300 engineers in developing cutting-edge advanced circuit simulation and transistor-level sign-off products, including characterization and static timing analysis. With 27 years of industry … Read More


Accelerate AI Performance with 9G+ HBM3 System Solutions

Accelerate AI Performance with 9G+ HBM3 System Solutions
by Kalar Rajendiran on 03-06-2024 at 10:00 am

HBM3 PHY and Controller Memory Solution

In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More


Optimize AI Chips with Embedded Analytics

Optimize AI Chips with Embedded Analytics
by Kalar Rajendiran on 09-02-2021 at 6:00 am

Tessent Embedded Analytics Architecture

The foundry model, multi-source IP blocks, advanced packaging technologies, cloud computing, hyper-connectivity and access to open-source software have all contributed to the incredible electronics products of recent times. Along with this, the complexity of developing and taking a chip to market has also increased. And… Read More


Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+

Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+
by Mitch Heins on 09-20-2017 at 12:00 pm

Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with… Read More


Which High B/W Memory to Select after DDR4?

Which High B/W Memory to Select after DDR4?
by Eric Esteve on 07-11-2015 at 6:00 am

Once upon a time, RAM technology was the driver of the semiconductor process. DRAM products were the first to be designed on a newest technology node and DRAM was used as a process driver. It was 30 years ago and the most aggressive process nodes were ranging between 1um and 1.5 um (1 500 nm!). Then in the 1990 the Synchronous Dynamic … Read More