At Intel back in the late 1970’s we wanted to know what process corner each DRAM chip and wafer was trending at so we included a handful of test transistors in the scribe lines between the active die. Having test transistors meant that we could do a quick electrical test at wafer probe time to measure the P and N channel transistor… Read More
Why It’s A Good Idea to Embed PVT Monitoring IP in SoCs
