Mind The Gap – Boarding the Silicon Photonics Packaging Train

Mind The Gap – Boarding the Silicon Photonics Packaging Train
by Mitch Heins on 05-01-2016 at 8:00 pm


I’ve been doing a lot of reading on silicon photonics lately and I’ve come to realize that while there is much written on the development of individual silicon photonic components and devices (modulators, photo detectors, optical amplifiers and such) that much of the cost and therefore chances of economic success… Read More