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EDA CEO Outlook 2018by Daniel Nenni on 04-06-2018 at 12:00 pmCategories: EDA, Events
The EDA CEO outlook took an interesting turn last night but before I get into that I will offer a few comments about the start of the show. I attend this event every year for the content but also for the networking. It isn’t everyday you get to hang out with semiconductor industry elite and have candid conversations over food and drinks.… Read More
“Thinking Outside the Chip”by Students@olemiss.edu on 04-13-2016 at 7:00 amCategories: EDA
While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More
