If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More
2019 will be a big year for PCIe. With the approval of version 0.9 of the Base Layer for PCIe 5.0, implementers have a solid foundation to begin working on designs. PCIe 4.0 was introduced in 2017, before that the previous PCIe 3.0 was introduced in 2010 – ages ago in this industry. In fact, 5.0 is so close on the heels of 4.0, many products… Read More
The global Interface IP market is still growing in 2015, no doubt about it. It’s interesting to zoom in the various protocols to check their respective behavior. Which protocol generates an IP business growing more than the average market? Which protocol generates a disappointing IP business? In other words, which are the winners… Read More
In this era of high-performance, low-power, and low-cost devices coming up at an unprecedented scale, the SoCs can never attain the ultimate in performance; always there is scope for improvement. Several methods including innovative technology, multi-processor architecture, memory, data traffic management for low latency,… Read More
Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More
