Artificial intelligence (AI) has revolutionized data center infrastructure, requiring a reimagining of computational, memory, and connectivity technologies. Meeting the increasing demand for high performance and efficiency in AI workloads has led to the emergence of innovative solutions, including chiplets, advanced… Read More
Tag: Co-packaged optics
How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
Soitec Delivers the Foundation for Next-Generation Interconnects
Soitec is a unique company that is at the center of major changes in our industry. Technology megatrends are fueling massive demand for semiconductors and this has increased the adoption of engineered substrates. As a global leader in the development of engineered substrates, Soitec is a company to watch. While this technology… Read More
Navigating the 1.6Tbps Era: Electro-Optical Interconnects and 224G Links
In the relentless pursuit of ever-increasing data speeds, the 1.6 Terabits per second (Tbps) era looms on the horizon, promising unprecedented levels of connectivity and bandwidth within data centers. As data-intensive applications proliferate and the demand for real-time processing escalates, the need for robust and efficient… Read More
Silicon Photonics Solutions Address Bandwidth, Reach, and Power Challenges
A couple of weeks ago, I blogged on GlobalFoundries’ silicon technologies supporting automotive radar applications. This time it is on GlobalFoundries’ silicon photonics technology which expects to find adoption in a broad spectrum of applications. The blog is based on listening to a technology presentation made by Dr. … Read More