The explosion of artificial intelligence (AI) is transforming the data center landscape, pushing the boundaries of compute, connectivity, and memory technologies. The exponential growth in AI workloads—training large language models (LLMs), deploying real-time inference, and scaling distributed applications—has … Read More
Tag: chiplets
SEMICON Taiwan 2025
Leading with Collaboration. Innovating with the World.
SEMICON Taiwan 2025 will take place from September 10–12, 2025 at the Taipei Nangang Exhibition Center!
This year’s exhibition will bring together over 1,100 leading semiconductor and technology companies, with more than 4,000 booths and an expected attendance of over… Read More
Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling
The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More
Arteris at the 2025 Design Automation Conference #62DAC
Key Takeaways:
- Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
- Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Keysight at the 2025 Design Automation Conference #62DAC
Keysight Showcases AI-Ready EDA and Multi-Physics Innovation at #62DAC
Design engineers attending #62DAC who focus on Design Data & IP Management, Analog, Mixed-Signal, RFIC, MMIC, or Multi-Physics should make booth #1408 a top destination. I had the opportunity to speak with Simon Rance, General Manager & Business… Read More
Podcast EP288: How Alphawave Semi Enables Next Generation Connectivity with Bharat Tailor
Dan is joined by Bharat Tailor who is responsible for the Alphawave standard connectivity products portfolio focused on DSP chipsets enabling AI data center interconnects. He is a veteran of the high-speed connectivity semiconductor industry having participated in the evolution of connectivity technologies from 10Gbps … Read More
ESD Alliance Executive Outlook Features View of How Multi-Physics is Reshaping Chip Design and EDA Tools
Every spring, the ESD Alliance, a SEMI Technology Community, organizes a get together where industry executives and experts gather to network and talk about trends in the electronic design automation industry.
The theme of this year’s event, once again co-hosted by Keysight, is “How Multi-Physics is Reshaping Chip Design and… Read More
Podcast EP276: How Alphawave Semi is Fueling the Next Generation of AI Systems with Letizia Giuliano
Dan is joined by Letizia Giuliano, Vice President of Product Marketing and Management at Alphawave Semi. She specializes in architecting cutting-edge solutions for high-speed connectivity and chiplet design architecture. Prior to her role at Alphawave Semi, Letizia held the position of Product Line Manager at Intel, where… Read More
Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration
The dominance of GPUs in AI workloads has long been driven by their ability to handle massive parallelism, but this advantage comes at the cost of high-power consumption and architectural rigidity. A new approach, leveraging a chiplet-based RISC-V vector processor, offers an alternative that balances performance, efficiency,… Read More
Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More