The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
Tag: chiplets
Accelerating Automotive SoC Design with Chiplets
The automotive industry is evolving rapidly with the increasing demand for intelligent, connected, and autonomous vehicles. Central to this transformation are System-on-Chip (SoC) designs, which integrate multiple processing units into a single chip for managing everything from safety systems to in-car entertainment.… Read More
Scaling AI Data Centers: The Role of Chiplets and Connectivity
Artificial intelligence (AI) has revolutionized data center infrastructure, requiring a reimagining of computational, memory, and connectivity technologies. Meeting the increasing demand for high performance and efficiency in AI workloads has led to the emergence of innovative solutions, including chiplets, advanced… Read More
Webinar: Accelerating Automotive SoC Design with Chiplets
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures.
Learn how Cadence’s advanced automotive solutions address the increasing… Read More
How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
5 Expectations for the Memory Markets in 2025
TechInsights has a new memory report that is worth a look. It is free if you are a registered member which I am. HBM is of great interest and there is a section on emerging and embedded memories for chip designers. Even though I am more of a logic person, memory is an important part of the semiconductor industry. In fact, logic and memory
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Daniel Nenni at the 2024 Design Automation Conference
This year’s live semiconductor ecosystem conferences have been well attend and I expect the same for #61DAC next week. I will be at the conference from Sunday afternoon to Wednesday evening, if you would like to meet let me know. Networking is an important part of the semiconductor ecosystem so let’s make it happen.… Read More
Mirabilis Design at the 2024 Design Automation Conference
This is the first time in 28 years of my visits to DAC that I have seen so many different technologies arrive at DAC in the same year. Earlier we would have one or possibly two innovative breakthroughs in semiconductors and embedded systems that emerged at DAC. This year I expect six or may be seven to arrive, and I am not including the… Read More