Tag: chiplets

Webinar: Accelerating Automotive SoC Design with Chiplets

Webinar: Accelerating Automotive SoC Design with Chiplets
by Admin on 10-28-2024 at 3:37 pm

Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures.

Learn how Cadence’s advanced automotive solutions address the increasing… Read More

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How AI is Redefining Data Center Infrastructure: Key Innovations for the Future

How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
by Kalar Rajendiran on 10-10-2024 at 10:00 am
Categories: AI, Alphawave Semi, Chiplet, IP, Silicon Photonics

Connectivity Demands for AI Alphawave Semi

Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More

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Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am
Categories: 3D IC, AI, Analytics, Chiplet, EDA, Foundries, IP, TSMC

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More

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5 Expectations for the Memory Markets in 2025

5 Expectations for the Memory Markets in 2025
by Daniel Nenni on 10-01-2024 at 10:00 am
Categories: 3D IC, Chiplet, Semiconductor Services, TechInsights
1 Comment

Expectations for the Memory Markets in 2025

TechInsights has a new memory report that is worth a look. It is free if you are a registered member which I am. HBM is of great interest and there is a section on emerging and embedded memories for chip designers. Even though I am more of a logic person, memory is an important part of the semiconductor industry. In fact, logic and memory

… Read More
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Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am
Categories: 3D IC, AI, Automotive, Chiplet, EDA, IP, Synopsys

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More

Advanced Packaging Conference (APC) 2024

Advanced Packaging Conference (APC) 2024
by Admin on 07-23-2024 at 8:30 pm

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance… Read More

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Daniel Nenni at the 2024 Design Automation Conference

Daniel Nenni at the 2024 Design Automation Conference
by Daniel Nenni on 06-21-2024 at 4:00 pm
Categories: 3D IC, Chiplet, Events

DAC 2024 Banner

This year’s live semiconductor ecosystem conferences have been well attend and I expect the same for #61DAC next week. I will be at the conference from Sunday afternoon to Wednesday evening, if you would like to meet let me know. Networking is an important part of the semiconductor ecosystem so let’s make it happen.… Read More

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Mirabilis Design at the 2024 Design Automation Conference

Mirabilis Design at the 2024 Design Automation Conference
by Deepak Shankar on 06-18-2024 at 10:00 am
Categories: AI, Chiplet, Events, IP, Mirabilis Design, RISC-V

DAC 2024 Banner

This is the first time in 28 years of my visits to DAC that I have seen so many different technologies arrive at DAC in the same year.  Earlier we would have one or possibly two innovative breakthroughs in semiconductors and embedded systems that emerged at DAC. This year I expect six or may be seven to arrive, and I am not including the… Read More

Webinar: The Era of Software-Defined Everything: Chiplets and Bespoke Silicon

Webinar: The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
by Admin on 04-12-2024 at 2:03 pm

From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build “software-defined solutions” that are differentiated in their respective markets. Sign up and save your spot for this special presentation.

TIME:
APRIL 25, 2024
9 AM EDT / 3 PM CEST / 6:30 PM IST

Venue:
Virtual

… Read More
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The Data Crisis is Unfolding – Are We Ready?

The Data Crisis is Unfolding – Are We Ready?
by Kalar Rajendiran on 04-09-2024 at 6:00 am
Categories: AI, Alphawave Semi, Automotive, Chiplet, IoT, IP
1 Comment

Global Data Sphere for Healthcare Data

The rapid advancement of technology, including generative AI, IoT, and autonomous vehicles, is revolutionizing industries and enhancing efficiency. At the same time, such advances also generate huge amounts of data to be transmitted and processed to make sense and provide value to consumers and society as a whole. In essence,… Read More