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Dan is joined by Letizia Giuliano, Vice President of Product Marketing and Management at Alphawave Semi. She specializes in architecting cutting-edge solutions for high-speed connectivity and chiplet design architecture. Prior to her role at Alphawave Semi, Letizia held the position of Product Line Manager at Intel, where… Read More
The dominance of GPUs in AI workloads has long been driven by their ability to handle massive parallelism, but this advantage comes at the cost of high-power consumption and architectural rigidity. A new approach, leveraging a chiplet-based RISC-V vector processor, offers an alternative that balances performance, efficiency,… Read More
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
The automotive industry is evolving rapidly with the increasing demand for intelligent, connected, and autonomous vehicles. Central to this transformation are System-on-Chip (SoC) designs, which integrate multiple processing units into a single chip for managing everything from safety systems to in-car entertainment.… Read More
Artificial intelligence (AI) has revolutionized data center infrastructure, requiring a reimagining of computational, memory, and connectivity technologies. Meeting the increasing demand for high performance and efficiency in AI workloads has led to the emergence of innovative solutions, including chiplets, advanced… Read More
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
TechInsights has a new memory report that is worth a look. It is free if you are a registered member which I am. HBM is of great interest and there is a section on emerging and embedded memories for chip designers. Even though I am more of a logic person, memory is an important part of the semiconductor industry. In fact, logic and memory
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As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
This year’s live semiconductor ecosystem conferences have been well attend and I expect the same for #61DAC next week. I will be at the conference from Sunday afternoon to Wednesday evening, if you would like to meet let me know. Networking is an important part of the semiconductor ecosystem so let’s make it happen.… Read More
