You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures.
Learn how Cadence’s advanced automotive solutions address the increasing… Read More
Dan is joined by Amol Borkar, Product Marketing Director at Cadence. Since joining in 2018 as a senior product manager, he has led the development of many successful hardware and software products, including Tensilica’s latest Vision 331 and Vision 341 DSPs and 4DR accelerator targeted for various vision, automotive and AI edge… Read More
While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration… Read More
As electric vehicles (EVs) gain widespread adoption, safety, reliability, and efficiency are becoming increasingly important. A crucial component in ensuring these aspects is the power module (PM), which manages the energy flow between the EV battery and the motor. The design of these power modules must not only meet the high-performance… Read More
Even for experienced technologists some technologies can seem almost indistinguishable from magic. One example is the bird’s eye camera view available on your car’s infotainment screen. This view appears to be taken from a camera hovering tens of feet above your car. As an aid to parallel parking, it’s a brilliant invention; … Read More
Accellera invited me to attend their #61DAC panel discussion about the new Portable Stimulus Standard (PSS) v3.0, and the formal press release was also just announced. The big idea with PSS is to enable seamless reuse of stimulus across simulation, emulation and post-silicon debug and prototyping.
Tom Fitzpatrick from Siemens… Read More
The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More
As the automotive industry continues to evolve, the demands for high-capacity, high-speed storage solutions are intensifying. Autonomous vehicles and V2X (Vehicle-to-Everything) communication systems generate and process massive amounts of data, necessitating advanced storage technologies capable of meeting these… Read More
The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More
The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More
