Webinar: Post-layout Circuit Sizing Optimization

Webinar: Post-layout Circuit Sizing Optimization
by Daniel Payne on 09-29-2022 at 4:00 pm

IC design workflow min

My IC design career started out with manually sizing transistors to improve performance, while minimizing layout area and power consumption. Fortunately we don’t have to do manual transistor sizing anymore, thanks to EDA tools that are quicker and more accurate than manual methods. MunEDA is an EDA vendor that has developed… Read More


System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs

System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs
by Tom Dillinger on 06-08-2017 at 4:00 pm

Regular Semiwiki readers are aware of the rapid emergence of various (multi-die) advanced package technologies, such as: FOWLP (e.g., Amkor’s SWIFT, TSMC’s InFO); 2D die placement on a rigid substrate (e.g., TSMC’s CoWoS); and, 2.5D “stacked die” with vertical vias (e.g., any of the High Bandwidth Memory,… Read More


Analog Design Verification — Traceability is Required

Analog Design Verification — Traceability is Required
by Tom Dillinger on 04-05-2016 at 9:45 am

Digital verification engineers have developed robust, thorough metrics for evaluating design coverage. Numerous tools are available to evaluate testbenches against RTL model descriptions — e.g., confirming that simulation regressions exhaustively exercise signal toggles, RTL statement lines, individual statement… Read More