Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures

Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
by Kalar Rajendiran on 02-12-2025 at 6:00 am

Chiplets A New Abstraction Layer

The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More


Webinar: Enabling RF and mmWave Design Success with Advanced Models

Webinar: Enabling RF and mmWave Design Success with Advanced Models
by Admin on 01-24-2025 at 2:22 pm

Time: 06:00 ET / 11:00 GMT / 12:00 CET / 15:00 GST

Traditionally, measured S-parameter data files in the RF and mmWave industry have been the most commonly available “model” to represent passive devices as well as active devices in some cases. However, S-parameters are not accurate enough when designing active devices in which

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CadenceTECHTALK: Addressing Thermal Design Challenges with In-Design Analysis

CadenceTECHTALK: Addressing Thermal Design Challenges with In-Design Analysis
by Admin on 01-24-2025 at 1:55 pm

A “PCB thermal analysis” design activity has traditionally involved the PCB designer transferring a finished design to a dedicated thermal analysis tool. While this has indeed successfully contributed to numerous PCB thermal signoffs in the past, there are inefficiencies that can be mitigated with the use of Cadence’s Allegro… Read More


Webinar: Getting Started with Electrical Constraints in OrCAD X

Webinar: Getting Started with Electrical Constraints in OrCAD X
by Admin on 01-24-2025 at 1:53 pm

Properly constraining your design is a must whether designing for high-speed, high-voltage, or high-density. Electrical Constraints in OrCAD X give designers the tools to control routing based on impedance and timing requirements, allowing users to analyze and tune those signals and reuse information between designs.

Join… Read More


Seminar: Empowering Electronics from Package to System Integration – San Jose

Seminar: Empowering Electronics from Package to System Integration – San Jose
by Admin on 01-24-2025 at 1:42 pm

Join Us for Ultra-Low-Power and Advanced Design

Explore the future of systems at CadenceCONNECT: Design the Future of Systems Together. This ultra-low- power and advanced design seminar dives into the critical methodologies and technologies you need to tackle low-power design challenges while achieving performance, area,

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Seminar: Empowering Electronics from Package to System Integration – Austin

Seminar: Empowering Electronics from Package to System Integration – Austin
by Admin on 01-24-2025 at 1:38 pm

Why You Should Attend

Optimizing power is no longer optional—it’s critical for advanced designs. This seminar will provide cutting-edge insights and practical methodologies to:

  • Design efficient, low-power architectures
  • Accurately analyze and optimize power at every stage of the design flow
  • Seamlessly implement
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Webinar: Trends in Semiconductor System Design

Webinar: Trends in Semiconductor System Design
by Admin on 01-24-2025 at 1:34 pm

About this event

Thank you to our sponsors, Synopsys and Cadence

The Trends in System Design event, hosted by DESN in Reading on February 6th, will be open to both members and non-members. We will examine emerging trends in semiconductor system design, with a particular focus on how AI/ML is being used in product design and the design… Read More


Webinar: Integrate Analysis into PCB Design with Sigrity X Aurora

Webinar: Integrate Analysis into PCB Design with Sigrity X Aurora
by Admin on 01-24-2025 at 1:30 pm

Historically, PCB power distribution networks (PDNs) have been designed based on rules of thumb, such as “put a 0.1uF decoupling cap down for every power pin on the device”. These can lead to more capacitors than necessary, taking up additional space in the layout and driving up cost of the final assembly. In addition, they can lead… Read More


Webinar: The Impact on the Automotive Market as Chips Transform Into 3D Systems

Webinar: The Impact on the Automotive Market as Chips Transform Into 3D Systems
by Admin on 01-24-2025 at 1:27 pm

The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren’t just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components… Read More


Webinar: Addressing Tomorrow’s Automotive Compute Needs with Cadence

Webinar: Addressing Tomorrow’s Automotive Compute Needs with Cadence
by Admin on 01-24-2025 at 1:25 pm

The automotive sector is transitioning to software-defined vehicles, focusing on unified compute solutions for central processing, zonal architectures, in-cabin sensing, and digital cockpits. With AI/ML enhancing vehicle functionalities, cars are becoming akin to mobile devices, especially as we advance towards autonomous… Read More