In July, I explored the benefits of the new Cadence Tempus™ Power Integrity Solution. In that piece, I explored some of the unique capabilities of this new tool with Brandon Bautz, senior product management group director and Hitendra Divecha, product management director in the Digital & Signoff Group at Cadence. I recently… Read More
Dan is joined by Brandon Bautz, senior group director of product management responsible for silicon signoff and verification product lines in the Cadence Digital & Signoff Group. Brandon has more than 20 years of experience in chip design and the EDA industry and has been at Cadence for over 10 years.
Dan explores the current… Read More