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The introduction of direct die-to-die bonding technology into high volume production has the potential to substantially affect the evolution of the microelectronics industry. The concerns relative to the “end of Moore’s Law”, the diminishing returns of continued (monolithic) CMOS process scaling, and the disruptive effect… Read More
As the size and complexity of System On Chip design has rapidly expanded in recent years, the need to use cache memory to improve throughput and reduce power has increased as well. Originally, cache memory was used to prevent what was then a single processor from making expensive off chip access for program or data memory. With the… Read More
