Multiphysics Analysis from Chip to System

Multiphysics Analysis from Chip to System
by akanksha soni on 04-10-2023 at 10:00 am

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Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More


Checklist to Ensure Silicon Interposers Don’t Kill Your Design

Checklist to Ensure Silicon Interposers Don’t Kill Your Design
by Dr. Lang Lin on 03-20-2023 at 10:00 am

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Traditional methods of chip design and packaging are running out of steam to fulfill growing demands for lower power, faster data rates, and higher integration density. Designers across many industries – like 5G, AI/ML, autonomous vehicles, and high-performance computing – are striving to adopt 3D semiconductor… Read More


WEBINAR: How to Accelerate Ansys RedHawk-SC in the Cloud

WEBINAR: How to Accelerate Ansys RedHawk-SC in the Cloud
by Daniel Nenni on 09-28-2022 at 8:00 am

How to Accelerate Ansys RedHawk SC in the Cloud

 

As we all know, growing complexity of IC designs and the resulting numbers of EDA tools and design steps lead to very intricate workflows which require compute cycles that outstrip current compute capacity of most IC enterprises. The obvious question is how to efficiently leverage near infinite compute capacity in the … Read More


Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More