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Chip designers are familiar with the additional physical design checking requirements that were incorporated into flows at advanced process nodes. With the introduction of optical correction and inverse lithography technology applied during mask data generation, and with the extension of a 193nm exposure source to finer… Read More
"Rigid-Flex Design is Coming"by Tom Dillinger on 10-04-2016 at 12:00 pmCategories: Cadence, EDA
Printed circuit boards that incorporate a combination of traditional PCB technology with flexible substrates, aka rigid-flex designs, have enabled an increasing variety of product designs, that leverage the unique physical form factor and lightweight options that rigid-flex technology offers. Yet, this technology requires… Read More
