CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More
Software defined vehicles (SDVs) are transforming the automotive industry. Today’s vehicles are connected computing platforms that rely on advanced processors, artificial intelligence (AI), over the air (OTA) software updates, cloud services, and vehicle to everything (V2X) communications. Every electronic … Read More
Simon Davidmann is a renowned EDA industry pioneer and serial technology entrepreneur with more than 40 years of experience in simulation and verification. After Synopsys acquired Imperas, which he founded in 2005, he was Synopsys Vice President responsible for Processor Modeling and Simulation. He left Synopsys in 2025 and… Read More
Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI system aimed at helping… Read More
AI-driven semiconductor systems are the next major transformation in chip design and manufacturing. The central idea is that semiconductor workflows are becoming too complex, too data-intensive, and too time-sensitive to be managed only through traditional human-driven engineering processes. Modern chips now involve… Read More
Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More
AI inference is quickly becoming the real battleground for next-generation computing. Training still gets the headlines, but inference is where AI becomes a business, a service, and an infrastructure problem. Every chatbot response, agentic workflow, code assistant, scientific model, and enterprise copilot depends on … Read More
Every two years, the world of electronics meets at electronica in Munich, Germany. As the world’s leading trade fair, it showcases the full range of technologies, products, and solutions that are empowering an All Electric Society (AES). Practice-oriented forums and… Read More
Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More
As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
