December 2, 2025 – 11:00 AM EST
December 3, 2025 – 10:00 AM JST/KST
Discover the 5 Critical Advanced Packaging Market Trends Reshaping Semiconductors in 2026
AI, 3D stacking, and next-gen substrates—what’s next for advanced packaging.
The advanced packaging industry is at the forefront of semiconductor innovation, … Read More
Keeping up with the furious pace of AI innovation probably doesn’t allow a lot of time for deep analysis across many use cases. However I can’t help feeling we’re sacrificing quality and ultimately end user acceptance of AI by prioritizing new capabilities over rigorous productization. I am certain that product companies do rigorous… Read More
The evolution of AI workloads has profoundly influenced hardware design, shifting from single-GPU systems to massive rack-based clusters optimized for parallelism and efficiency. As outlined in this Hot Chips 2025 tutorial, this transformation began with foundational models like AlexNet in 2012 and continues with today’s… Read More
COMPUTEX Taipei 2026by Admin on 08-27-2025 at 11:07 pm
Main Themes
COMPUTEX is a leading global exhibition focused on AIoT and startups.
The expo will continue with the position of “AI Next”,
featuring the latest tech trends: AI & Robotics, Next-Gen Tech, and Future Mobility.
Recognized for its adaptability to industry changes.
It has established itself as a premier platform… Read More
By now everyone knows that AI has become the all-consuming driver in tech and that NVIDIA GPU-based platforms are the dominant enabler of this revolution. Datacenters worldwide are stuffed with such GPUs, serving AI workloads from automatically drafting emails and summarizing meetings to auto-creating software and controlling… Read More
I have seen a flood of verification announcements around directly reading product specs through LLM methods, and from there directly generating test plans and test suite content to drive verification. Conceptually automating this step makes a lot of sense. Carefully interpreting such specs even today is a largely manual task,… Read More
My first panel discussion at DAC 2025 was all about using AI for digital implementation, as Siemens has a digital implementation tool called Aprisa which has been augmented with AI to produce better results, faster. Panelists were from Samsung, Broadcom, MaxLinear, AWS and Siemens. In the past it could take an SoC design team… Read More
On July 18, 2025, Serge Nicoleau from STMicroelectronics delivered a compelling presentation at DACtv, as seen in the YouTube video exploring how artificial intelligence (AI) is revolutionizing semiconductor design, edge computing, and sustainability. Addressing a diverse audience, Serge highlighted AI’s pervasive … Read More
On July 9, 2025, a DACtv session illuminated the transformative role of artificial intelligence (AI) in chip design, as presented by Ankur Gupta of Siemens EDA in the YouTube video. The speaker explored how AI is revolutionizing electronic design automation (EDA), addressing the semiconductor industry’s challenges in managing… Read More
On July 9, 2025, a DACtv session by Dr. Peter Levin explored the transformative impact of artificial intelligence (AI) on chip design, as presented in the YouTube video. The speaker, an industry expert, delved into how AI is reshaping electronic design automation (EDA), addressing the escalating complexity of modern chips and… Read More
