Custom and Analog-Mixed Signal (AMS) IC design are used when the highest performance is required, and using digital standard cells just won’t meet the requirements. Manually sizing schematics, doing IC layout, extracting parasitics, then measuring the performance only to go back and continue iterating is a long, tedious… Read More
Tag: ai/ml
WEBINAR: The Power of Formal Verification: From flops to billion-gate designs
Semiconductor industry is going through an unprecedented technological revolution with AI/ML, GPU, RISC-V, chiplets, automotive and 5G driving the hardware design innovation. The race to deliver high performance, optimizing power and area (PPA), while ensuring safety and security is truly on. It has never been a more exciting… Read More
Altair’s Jim Cantele Predicts the Future of Chip Design
We all know chip design is changing in substantial ways and at a fast pace. The demands being placed on semiconductor systems are growing dramatically, and the innovation being delivered to address those demands is just as dramatic. Everyone seems to have an opinion on these trends, and a set of predications to make sense out of it… Read More
The Siemens Digital Industries Software View of AI and its Impact on System Design
The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen and how those technologies… Read More
Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
Highlights:
- Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
- There will be technical presentations every hour in the Ansys Booth Theater (#1539)
- Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
Chiplet Q&A with John Lee of Ansys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
Pushing Acceleration to the Edge
As more AI applications turn to edge computing to reduce latencies, the need for more computational performance at the edge continues to increase. However, commodity compute engines don’t have enough compute power or are too power-hungry to meet the needs of edge systems. Thus, when designing AI accelerators for the edge, Joe… Read More
The Increasing Gap between Semiconductor Companies and their Customers
Semiconductors sit at the heart of the electronics revolution, and the scaling enabled by Moore’s law has had a transformational impact on electronics as well as society. Traditionally, the relationship between semiconductor companies and their customers has been a function of the volume driven by the customer. In very … Read More
The Increasing Gaps in PLM Systems with Handling Electronics
Product LifeCycle Management (PLM) systems have shown incredible value for integrating the enterprise with a single view of the product design, deployment, maintenance, and end-of-life processes. PLM systems have traditionally grown from the mechanical design space, and this still forms their strength.
Meanwhile, due… Read More
Machine Learning in the Fab at #59DAC
It used to be true that a foundry or fab would create a set of DRC files, provide them to designers, and then the process yield would be acceptable, however if the foundry knows more details about the physical implementation of IC designs then they can improve the yield. Using a digital twin of the design, process and metrology steps… Read More