As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
Synopsys Webinar | Wednesday, August 23, 2023 | 10:00 a.m. PDT
Continuously increasing semiconductor design sizes and complexity have resulted in increased test costs. Today’s competitive environment and critical market windows are pushing companies to adopt aggressive design schedules. The traditional method of manual
Synopsys Webinar | Wednesday, July 19, 2023 | 10:00 a.m. PDT
Complexity brought on by advanced process nodes have opened the door to challenges in achieving optimal power, performance, and area (PPA). Manual methods are no longer viable given shrinking market windows. The need to drive for better results faster is increasing,
Earlier in April, Achronix made a product announcement with the headline “Achronix Now Shipping Industry’s Highest Performance Speedster7t FPGA Devices.” The press release drew attention to the fact that the 7nm Speedster®7t AC7t1500 FPGAs have started shipping to customers ahead of schedule. In the complex product world… Read More
The 54th annual DAC event is fast approaching, so I hope to see many of you in Austin on June 18-21. The phrases Machine Learning and AI are growing in all areas of software, so I’m glad to see it appearing in more EDA tool offerings over the past year or so. One company that I plan to visit at DAC is Platform Design Automation because… Read More
