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As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
The transition to advanced process nodes is reshaping high-speed interface IP requirements for mobile, automotive, AR/VR, and AI edge devices. As SoC designers migrate to cutting-edge foundry technologies, the demand for highly optimized MIPI PHY solutions continues to grow. A key development in this space is the availability… Read More
Intel CEO Lip-Bu Tan’s statement that “re-spins get you fired” reflects the enormous pressure facing semiconductor companies as chip complexity, manufacturing costs, and competitive demands continue to rise. In the semiconductor industry, a “re-spin” occurs when a chip design must be revised and manufactured again because… Read More
As semiconductor manufacturing becomes increasingly dependent on uninterrupted power and energy efficiency, battery reliability has emerged as a critical operational issue for advanced fabs. Taiwan Semiconductor Manufacturing Company, better known as TSMC, is addressing this challenge through an ambitious global initiative… Read More
Power-SOI technology is rapidly emerging as a foundational platform for next-generation functional safety integrated circuits used in autonomous vehicles, industrial automation, humanoid robotics, and other mission-critical systems. The growing convergence of high-voltage power management and low-voltage digital… Read More
Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More importantly, this is no longer just… Read More
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More
A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More
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Podcast EP357: How Gonka is Changing the Way AI is Accessed with David Liberman