Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More
The Technical Problem Is Often Not the Business Problem
By Prof. Dr. S. Filo Ambrosini
On a semiconductor line, a rising defect rate can trigger a familiar debate. Do we need a new inspection system? More sensors? An additional engineer?
Those may all be valid responses. But before making the decision, someone needs to establish when the change began, where it first appears, and whether… Read More
Broadcom’s AI Engine Shifts Into Overdrive
Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More
TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
ASML Has High-NA and Chipmakers Can’t Say No
ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More
Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy.
There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More
Nvidia Sees AGI While OpenAI Sees Danger
Jensen Huang’s declaration that “AGI has arrived” is less a scientific verdict than a compressed statement about infrastructure, economics and momentum. His evidence is OpenAI’s GPT-6 Astra, reportedly trained on more than 100,000 Nvidia Grace Blackwell NVL72 systems, followed by a promise that another 400,000 GPUs are coming… Read More
Samsung Might Be the Most Unusual Company on Earth
Samsung might be the most unusual company on earth because it is difficult to decide what kind of company it actually is. To most consumers, Samsung means smartphones, televisions, refrigerators. Yet the name also appears on apartment towers, cargo ships, hospital equipment, insurance policies, construction projects, and… Read More
TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.
Mike and… Read More
Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI Inference
OpenAI’s Jalapeño is a custom accelerator designed specifically for AI inference, particularly the low-latency, multi-chip workloads behind interactive and agentic systems. Its central idea is that useful performance cannot be reduced to peak floating-point operations or memory bandwidth. What matters is how quickly … Read More


The silent killer of analog reliability: Why SPICE misses floating net