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Why Semiconductor AI Starts with Data, Not Algorithms

Why Semiconductor AI Starts with Data, Not Algorithms
by Admin on 10-15-2026 at 8:00 am

Fig1 context

The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions.

By Sriram Nithin Gopal Lanka

Every few months there is a new AI model that can do more and semiconductor manufacturers are under pressure to put them to work. But ask the engineers… Read More


Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score

Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score
by Joel Jorgensen on 10-14-2026 at 8:00 am

Writing the Score SemiWiki

Score: the written music for an orchestra, with every section’s part laid out on the same page so they play together. In this article, it’s your designed workflows.

Is AI helping you hit your tape-out date, or putting it at risk? How would you know?

Every Director I talk to is being asked to use AI to deliver faster, or better,… Read More


Teradyne Unveils Magnum E2 for the Next Wave of AI Memory

Teradyne Unveils Magnum E2 for the Next Wave of AI Memory
by Daniel Nenni on 10-13-2026 at 10:00 am

High speed memory testing for AI

Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and production… Read More


VSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives

VSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives
by Lauro Rizzatti on 10-13-2026 at 8:00 am

Sandra Rivera and the inference era

Sandra Rivera, Chair of VSORA, joined Bloomberg’s The Close in July for an interview on the current state of AI. What follows is a summary of that conversation.

When a Silicon Valley veteran who once ran Intel’s Data Center and AI Group, and now chairs a French inference-chip challenger, sits down with a tech journalist from Bloomberg,… Read More


Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs

Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs
by Daniel Nenni on 10-13-2026 at 6:00 am

Open software unites chips and AI

Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs, data, and business applications. The message is straightforward: accelerator… Read More


From 25 Million Pixels to a Six-Ounce Product: Engineering Visor for Manufacturing

From 25 Million Pixels to a Six-Ounce Product: Engineering Visor for Manufacturing
by Moh Kolb on 10-09-2026 at 8:00 am

From 25 million Pixels to six Ounce product Visors semiwiki sept30 (1)

By Dr. Moh Kolbehdari

Putting roughly 25 million pixels into a wearable device weighing about six ounces sounds, at first, like a display problem.

It is not.

The displays must fit behind an optical system capable of turning those pixels into a usable visual field. Compute must generate and move the required data. Power must support… Read More


TSMC 2026 OIP Ecosystem Forum Summary

TSMC 2026 OIP Ecosystem Forum Summary
by Daniel Nenni on 10-09-2026 at 8:00 am

TSMC Ecosystem Forum Summary

TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More


Data Center Energy Trends Force a Rethink of Chip Power Delivery

Data Center Energy Trends Force a Rethink of Chip Power Delivery
by Daniel Nenni on 10-08-2026 at 10:00 am

Data Center Energy Trends Force a Rethink of Chip Power Delivery

Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:

Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More


From Cloud to Silicon: IC-Link and TSMC Open the Door

From Cloud to Silicon: IC-Link and TSMC Open the Door
by Daniel Nenni on 10-07-2026 at 8:00 am

From Cloud to Silicon IC Link and TSMC Open the Door

Access to advanced semiconductor technology involves much more than choosing a process node. Design teams also need computing capacity, compatible tools, secure technology access, and experienced support. IC-Link by imec’s expanded collaboration with TSMC addresses that combination, potentially making sophisticated… Read More


Beyond the Die: Verifying the Connected Chip

Beyond the Die: Verifying the Connected Chip
by Daniel Nenni on 10-06-2026 at 10:00 am

Efficient, Scalable Methodology for Reliability and ESD Verification of Complex 3D IC CoWoS Systems

One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More