Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs, data, and business applications. The message is straightforward: accelerator… Read More
From 25 Million Pixels to a Six-Ounce Product: Engineering Visor for Manufacturing
By Dr. Moh Kolbehdari
Putting roughly 25 million pixels into a wearable device weighing about six ounces sounds, at first, like a display problem.
It is not.
The displays must fit behind an optical system capable of turning those pixels into a usable visual field. Compute must generate and move the required data. Power must support… Read More
TSMC 2026 OIP Ecosystem Forum Summary
TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More
Data Center Energy Trends Force a Rethink of Chip Power Delivery
Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:
Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More
From Cloud to Silicon: IC-Link and TSMC Open the Door
Access to advanced semiconductor technology involves much more than choosing a process node. Design teams also need computing capacity, compatible tools, secure technology access, and experienced support. IC-Link by imec’s expanded collaboration with TSMC addresses that combination, potentially making sophisticated… Read More
Beyond the Die: Verifying the Connected Chip
One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
Built to Deliver the Answer, Not to Train the Model
How VSORA rebalances memory and compute for AI inference in the data center and at the edge
For more than a decade, the AI hardware industry focused mainly on model training, while inference represented a smaller share of overall demand. That balance is changing as trained models are deployed widely in recommendation engines, … Read More
CEO Interview Greene Tweed
Magen Buterbaugh was appointed President and CEO of Greene Tweed in January 2023. A seasoned leader, with broad industry expertise, Magen has led multiple chemicals & materials-based businesses – spanning from startups to multibillion-dollar enterprises. She led and scaled new innovative research and development platforms… Read More
TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies
The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.
And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.
This … Read More
Intel Foundry: AI performance now depends on the whole system
For decades, chipmakers improved computing performance largely by putting more capable circuitry on a piece of silicon. That remains important, but AI is exposing its limits. Large models demand enormous amounts of data movement, sustained power and effective cooling. A fast processor cannot deliver its full benefit if memory… Read More


Intel’s Tiny Bridges Could Lead to Very Big Paychecks