We are in the midst of one of the most transformative periods for data center infrastructure. The explosion of AI, cloud-scale workloads, and hyperscale networking is forcing rapid innovation not only in compute and storage, but in the very fabric that connects them. At the recent Hot Chips conference, Pat Fleming gave a talk on… Read More
Advancements in High-Density Front- and Backside Wafer Connectivity: Paving the Way for CMOS 2.0
In the rapidly evolving semiconductor landscape, imec’s recent breakthroughs in wafer-to-wafer hybrid bonding and backside technologies are reshaping the future of compute systems. As detailed in their article, these innovations transition CMOS 2.0 from a conceptual framework to practical reality, enabling denser,… Read More
GlobalFoundries 2025 Update GTS25
“GTS25 brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable GF to design the essential chips the world relies on to live, work and connect.”
GlobalFoundries (GF), a leading contract semiconductor manufacturer, plays an important… Read More
Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More
Intel’s Pearl Harbor Moment
There is a lot of talk about where Intel went wrong, the latest is missing AI, but people seem to forget one of the more defining blunders in the history of Intel. In April of 2012 Kirk Skaugen, the new general manager of Intel’s client PC group, moderated a Q&A with Mark Bohr, a 33+ year Intel fellow, and Brad Heaney, the Ivy Bridge… Read More
Should the US Government Invest in Intel?
“Most companies don’t die because they are wrong; most die because they don’t commit themselves. They fritter away their valuable resources while attempting to make a decision. The greatest danger is standing still.” Andy Grove’s Only the Paranoid Survive, first published in 1996.
Looking back 20 years, we all know this… Read More
Should Intel be Split in Half?
A recent commentary from four former Intel board members argue that Intel should be split into two separate companies with separate CEOs and separate board of directors. Charlene Barshefsky, Reed Hundt, James Plummer, and David Yoffie wrote that Intel shareholders should insist on a split which would create a new, independent,… Read More
Making Intel Great Again!
Lip-Bu Tan made it very clear on his most recent call that Intel will not continue to invest in leading edge semiconductor manufacturing solo. Lip-Bu is intimately familiar with TSMC and that is the collaborative business model he envisions for Intel Foundry. I support this 100%. Intel and Samsung have tried to compete head-to-head… Read More
Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani
Dan is joined by Kaihan Ashtiani, Corporate Vice President and General Manager of atomic layer deposition and chemical vapor deposition metals in Lam’s Deposition Business Unit. Kaihan has more than 30 years of experience in technical and management roles, working on a variety of semiconductor tools and processes.
Dan explores… Read More
Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside
– Musk chip lifeline to Samsung comes with interesting strings attached
– Musk chose Samsung over Intel-What does that say about Intel?
– Musk will hold sway over Samsung much as Apple/NVDA over TSMC
– Will Musk do a “DOGE” on chip tool makers? How much influence?
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet