Dan is joined by Jungwoo Joh, a Process Development Manager at Texas Instruments and Publicity Chair for IEDM 2023. He currently leads gallium nitride technology development for power applications, and has been working on reliability, device characterization & modeling, and process development for various GaN based technologies as well as for high voltage silicon BCD processes. Jungwoo received his Ph.D. in Electrical Engineering from MIT. He has published more than 60 papers and holds 20 patents. He is a Senior Member of IEEE, and has been serving on IEDM technical and executive committees since 2015.
Dan’s other guest is Kang-ill Seo, Vice President of Samsung Electronics and Publicity Vice Chair for IEDM 2023. He directs Samsung’s international joint project with IBM at Albany Nanotech in New York state.His current research focuses on development of leading-edge logic technologies, including 3D transistor architectures, Interconnect with novel materials, and associated design-technology-co-optimization for next-generation devices for low-power and high-performance computing. Kang-ill earlier participated in and led the development of several generations of logic technologies, from 20nm to 7nm, in Samsung’s Semiconductor R&D center. He received his MS and Ph. D in Electrical Engineering and Material Science & Engineering from Stanford University. His has been published in 25 peer-review journals and conferences, and has more than 60 issued patents. He has served on the IEDM executive committee since 2018.
Dan explores what will be the popular topics at the upcoming IEDM with Jungwoo and Kang-ill. Energy conservation, sustainability and reduced carbon footprint are just a few of the many topics to be addressed. The evolution from 2D to 3D CMOS scaling at the device, circuit and chip levels are also discussed. New areas in memory design are discussed as well, along with changes to the conference program to support many new AI-driven innovations.
IEDM 2023 will be held in San Francisco from Dec. 9 – 13. You can register for the conference here.