Podcast EP112: How Cadence is Revolutionizing Full-Chip Signoff with Certus

Dan is joined by Brandon Bautz, Sr. Group Director of Product Management, responsible for the Cadence silicon signoff and verification product lines in the Digital & Signoff Group.

Dan and Brandon explore the substantial challenges faced by design teams needing to perform full-chip signoff at an accelerated pace for advanced nodes. Brandon details the unique capabilities of Certus and how it addresses the challenges customers face, making full-chip signoff far more efficient and predictable.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.

Semiconductor Insiders

Podcast EP112: How Cadence is Revolutionizing Full-Chip Signoff with Certus

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