I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More





Podcast EP198: How Lightmatter Creates the Foundation for the Next Moore’s Law with Ritesh Jain
Dan is joined by Ritesh Jain. Ritesh is the senior vice president of engineering and operations for Lightmatter. Prior to joining Lightmatter, Ritesh was a vice president in Intel’s Data Center and AI group where he directed the hardware development across silicon packaging, power integrity, signal integrity, mechanical &… Read More
CEO Interview: Sridhar Joshi of TenXer
Sridhar Joshi has more than Two and half decades of experience in the Semiconductor Industry. He spent Large part of his career working in various Engineering and leadership roles at National Semiconductor and Texas Instruments, including leading a company wide initiative for System Design and Technology, ARM Microcontroller… Read More
An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards
My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More
WEBINAR: FPGA-Accelerated AI Speech Recognition
The three-step conversational AI (CAI) process – automatic speech recognition (ASR), natural language processing, and text-to-synthesized speech response – is now deeply embedded in the user experience for smartphones, smart speakers, and other devices. More powerful large language models (LLMs) can answer more queries… Read More
RISC-V and Chiplets: A Panel Discussion
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
- Laurent Moll, COO of Arteris
- Aniket Saha, VP of Product Management of Tenstorrent
- Dale Greenley, VP of Engineering of Ventana
When Will Structured Assembly Cross the Chasm?
First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, … Read More
Using PCB Automation for an AI and Machine Vision Product
I knew that HDMI was a popular standard used to connect consumer products like a monitor to a laptop, but most professional video and broadcast systems use the SDI (Serial Digital Interface) connector standard. Pleora Technologies, founded in 2000, currently serves the machine vision and manufacturing markets, including those… Read More
Automated Constraints Promotion Methodology for IP to Complex SoC Designs
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More
WEBINAR: Joint Pre synthesis RTL & Power Intent Assembly flow for Large System on Chips and Subsystems
Nowadays, low power design requirements are key for large SoCs (system on chips) for different applications: AI, Mobile, HPC, etc. Power intent management early in the design flow is becoming crucial to help facing PPA (Power Performance Area) design challenges.
With the increasing complexity of such … Read More
Facing the Quantum Nature of EUV Lithography