Ceva webinar AI Arch SEMI 800X100 250625

Agile Analog Partners with sureCore for Quantum Computing

Agile Analog Partners with sureCore for Quantum Computing
by Daniel Nenni on 12-21-2023 at 10:00 am

Agile Analog sureCore project PR image

Quantum computing is the next big thing for the computing world. The semiconductor industry has been talking about it for years. It’s shiny, mysterious, and capable of some incredible things. Instead of using classical bits to represent information (which can be either a 0 or a 1), quantum computers use quantum bits or qubitsRead More


Seven Silicon Catalyst Companies to Exhibit at CES, the Most Powerful Tech Event in the World

Seven Silicon Catalyst Companies to Exhibit at CES, the Most Powerful Tech Event in the World
by Mike Gianfagna on 12-21-2023 at 6:00 am

Seven Silicon Catalyst Companies to Exhibit at CES, the Most Powerful Tech Event in the World

According to its website, CES® Is the global stage for innovation, delivering the most powerful tech event in the world — the proving ground for breakthrough technologies and global innovators. Owned and produced by the Consumer Technology Association (CTA)®, it is the only trade show that showcases the entire tech landscape… Read More


ReRAM Integration in BCD Process Revolutionizes Power Management Semiconductor Design

ReRAM Integration in BCD Process Revolutionizes Power Management Semiconductor Design
by Kalar Rajendiran on 12-20-2023 at 10:00 am

Power Analog ICs Adopting ReRAM

Weebit Nano, a leading developer of advanced memory technologies, recently announced a significant collaboration with DB HiTek, one of the top ten foundries of the world. The collaboration is designed to enable integration of Weebit’s Resistive Random-Access Memory (ReRAM) into DB HiTek’s 130nm Bipolar-CMOS-DMOS… Read More


Reasoning and Planning as the Next Big Thing in AI

Reasoning and Planning as the Next Big Thing in AI
by Bernard Murphy on 12-20-2023 at 6:00 am

Arithmetic min

When I search for ‘what is the next big thing in AI?’ I find a variety of suggestions around refining and better productizing what we already know. Very understandable for any venture aiming to monetize innovation in the near term, but I am more interested in where AI can move outside the box, to solve problems well outside the purview… Read More


CHIPS Act and U.S. Fabs

CHIPS Act and U.S. Fabs
by Bill Jewell on 12-19-2023 at 10:00 am

Major Future US Fabs

In August 2022, U.S. President Biden signed into law the CHIPS and Science Act of 2022 to provide incentives for semiconductor manufacturing in the United States. In a case of creating the acronym first and then finding a name to fit, CHIPS stands for Creating Helpful Incentives to Produce Semiconductors. The act provides a total… Read More


RISC-V Summit Buzz – Launchpad Showcase Highlights Smaller Company Innovation

RISC-V Summit Buzz – Launchpad Showcase Highlights Smaller Company Innovation
by Mike Gianfagna on 12-19-2023 at 8:00 am

RISC V Summit Buzz – Launchpad Showcase Highlights Smaller Company Innovation

One of the goals of the recent RISC-V Summit was to demonstrate that the RISC-V movement is real – major programs by large organizations committing to development around the RISC-V ISA. I would say this goal was achieved. Many high-profile announcements and aggressive, new architectures based on RISC-V were presented. On day … Read More


Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure

Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
by Kalar Rajendiran on 12-19-2023 at 6:00 am

Alphawave Semi 224G SerDes 1st TestChip

In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More


Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
by Daniel Nenni on 12-18-2023 at 10:00 am

New CEVA Logo
Company sharpens its strategy of delivering silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets

Ceva Inc. is an interesting company. Founded in November 2002, through the combination of the DSP IP licensing… Read More


Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions

Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions
by Mike Gianfagna on 12-18-2023 at 8:00 am

Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions

We all know about the relentless march of Moore’s Law. Denser, faster, and cheaper semiconductor devices that fuel the innovations that surround us. For this discussion, I will lump the significant movement from single chip advances to multi-chip strategies into a single thread as devices continue to get smaller, faster and … Read More


IEDM: TSMC Ongoing Research on a CFET Process

IEDM: TSMC Ongoing Research on a CFET Process
by Paul McLellan on 12-18-2023 at 6:00 am

Screen Shot 2023 12 16 at 12.16.14 PM

I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More