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What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration

What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration
by Mike Gianfagna on 02-03-2025 at 10:00 am

What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration

Multi-die design has become the center of a lot of conversation lately. The ability to integrate multiple heterogeneous devices into a single package has changed the semiconductor landscape, permanently. This technology has opened a path for continued Moore’s Law scaling at the system level. What comes next will truly be exciting.… Read More


2025 Outlook with Cristian Amitroaie, Founder and CEO of AMIQ EDA

2025 Outlook with Cristian Amitroaie, Founder and CEO of AMIQ EDA
by Daniel Nenni on 02-03-2025 at 6:00 am

ai assistant screenshot

Tell us a little bit about yourself and your company, AMIQ EDA.

We are an EDA company providing software tools targeting both chip design and chip verification. Our tools enable engineers to increase the speed and quality of new code development, simplify debugging and legacy code maintenance, accelerate language and methodology… Read More


Podcast EP272: An Overview How AI is Changing Semiconductor and System Design with Dr. Sailesh Kumar

Podcast EP272: An Overview How AI is Changing Semiconductor and System Design with Dr. Sailesh Kumar
by Daniel Nenni on 01-31-2025 at 10:00 am

Daniel Nenni is joined by Dr. Sailesh Kumar, CEO of Baya Systems. With over two decades of experience, Sailesh is a seasoned expert in SoC, fabric, I/O, memory architecture, and algorithms. Previously, Sailesh founded NetSpeed Systems and served as its Chief Technology Officer until its successful acquisition by Intel. Sailesh… Read More


CEO Interview: With Fabrizio Del Maffeo of Axelera AI

CEO Interview: With Fabrizio Del Maffeo of Axelera AI
by Daniel Nenni on 01-31-2025 at 6:00 am

Fabrizio Del Maffeo CEO Co Founder (1)

Fabrizio Del Maffeo is the CEO and co-founder of Axelera AI, the Netherlands-based startup building game-changing, scalable hardware for AI at the edge. Axelera AI was incubated by the Bitfury Group, a globally recognised emerging technologies company, where Fabrizio previously served as Head of AI. In his role at Axelera AI,… Read More


Automating Formal Verification

Automating Formal Verification
by Daniel Payne on 01-30-2025 at 10:00 am

LUBIS on cloud min

Formal verification methods are being adopted at a fast pace as a complement to traditional verification methods like functional simulation for IP blocks in SoC designs. I had a video meeting with Max Birtel, co-founder of LUBIS EDA and learned more about their history, products and vision. This company started recently in 2020… Read More


2024 Retrospective. Innovation in Verification

2024 Retrospective. Innovation in Verification
by Bernard Murphy on 01-30-2025 at 6:00 am

Innovation New

As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series on research ideas. As always, feedback welcome.

The 2024 Picks

These … Read More


Full Spectrum Transient Noise: A must have sign-off analysis for silicon success

Full Spectrum Transient Noise: A must have sign-off analysis for silicon success
by Scott Guyton on 01-29-2025 at 10:00 am

Figure 1

Noise minimization is required for advanced analog and radiofrequency (RF) circuits. Unlike digital circuits, where noise is a second-order effect, system performance metrics such as signal-to-noise ratio (SNR), phase noise, timing jitter, and bit error rate (BER) are directly affected in analog and RF designs. Effective… Read More


PSS and UVM Work Together for System-Level Verification

PSS and UVM Work Together for System-Level Verification
by Bernard Murphy on 01-29-2025 at 6:00 am

System level testing min

In the early days of the PSS rollout, some verification engineers were suspicious. Just as they were beginning to get comfortable with UVM, here came yet another standard to add to their learning and complexity overhead. Then the fog started to clear; UVM is ideal for block-level testing whereas PSS is ideal for system level testing.… Read More


Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More


Heterogeneous 2D/3D Packaging Challenges

Heterogeneous 2D/3D Packaging Challenges
by Daniel Payne on 01-27-2025 at 10:00 am

Innovator3D IC flow min

A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More