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Semiconductor Expert Forum

Podcast EP255: The Growing Proliferation of Semiconductors and AI in Cars with Amol Borkar

Podcast EP255: The Growing Proliferation of Semiconductors and AI in Cars with Amol Borkar
by Daniel Nenni on 10-25-2024 at 10:00 am

Dan is joined by Amol Borkar, Product Marketing Director at Cadence. Since joining in 2018 as a senior product manager, he has led the development of many successful hardware and software products, including Tensilica’s latest Vision 331 and Vision 341 DSPs and 4DR accelerator targeted for various vision, automotive and AI edge… Read More

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CEO Interview: Sean Park of Point2 Technology

CEO Interview: Sean Park of Point2 Technology
by Daniel Nenni on 10-25-2024 at 6:00 am
Categories: CEO Interviews

Sean Park scaled

Sean Park is a seasoned executive with over 25 years of experience in the semiconductors, wireless, and networking market. Throughout his career, Sean has held several leadership positions at prominent technology companies, including IDT, TeraSquare, and Marvell Semiconductor. As the CEO, CTO, and Founder at TeraSquare,… Read More

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From Space-Central to Space-Time Balanced – A Perspective for Moore’s Law 2.0 and A Holistic Paradigm for Emergence

From Space-Central to Space-Time Balanced – A Perspective for Moore’s Law 2.0 and A Holistic Paradigm for Emergence
by Daniel Nenni on 10-24-2024 at 4:00 pm
Categories: General

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A friend of SemiWiki published an article on Moore’s Law in IEEE that I think is worth reading:

IEEE Signal Processing Magazine, Vol. 41, Issue 4.

The topic of Moore’s Law is of paramount importance, reaching almost the entire field of electronics (and the semiconductor industry). In the course of six decades, for the first… Read More

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AI Semiconductor Market

AI Semiconductor Market
by Bill Jewell on 10-24-2024 at 2:00 pm
Categories: AI, Semiconductor Intelligence, Semiconductor Services
5 Comments

AI Semiconductor Market 2024

AI (artificial intelligence) is widely cited as a growth driver for the technology industry, including semiconductors. While AI is in its early stages, opinions vary on whether it will become common in the next few years. A McKinsey study from May 2024 showed 72% of organizations have adopted AI in at least one business function.… Read More

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The RISC-V and Open-Source Functional Verification Challenge

The RISC-V and Open-Source Functional Verification Challenge
by Daniel Nenni on 10-24-2024 at 10:00 am
Categories: Andes Technology, Arm, EDA, Emulation, IP, RISC-V, Siemens EDA

Semiwiki Blog Post #1 Image #1

Most of the RISC-V action at the end of June was at the RISC-V Summit Europe, but not all. In fact, a group of well-informed and opinionated experts took over the Pavilion stage at the Design Automation Conference to discuss functional verification challenges for RISC-V and open-source IP.

Technology Journalist Ron Wilson and … Read More

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Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers
by Mike Gianfagna on 10-24-2024 at 6:00 am
Categories: 3D IC, AI, Sarcina Technology, Semiconductor Services

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

2.5D package design is rapidly finding its stride in a wide variety of applications, including AI. While there are still many challenges to its widespread adoption, the chiplet approach is becoming more popular compared to monolithic design. However, the required market to create a chiplet ecosystem is still under development.… Read More

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Addressing Reliability and Safety of Power Modules for Electric Vehicles

Addressing Reliability and Safety of Power Modules for Electric Vehicles
by Kalar Rajendiran on 10-23-2024 at 10:00 am
Categories: Automotive, Cadence, EDA

Cadence Power Module Design Process

As electric vehicles (EVs) gain widespread adoption, safety, reliability, and efficiency are becoming increasingly important. A crucial component in ensuring these aspects is the power module (PM), which manages the energy flow between the EV battery and the motor. The design of these power modules must not only meet the high-performance… Read More

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Shaping Tomorrow’s Semiconductor Technology IEDM 2024

Shaping Tomorrow’s Semiconductor Technology IEDM 2024
by Scotten Jones on 10-23-2024 at 6:00 am
Categories: Events

IEDM 2024 SFO

Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.

Some highlight of this year’s technical program are:

AI  – Lots of artificial… Read More

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SI and PI Update from Cadence on Sigrity X

SI and PI Update from Cadence on Sigrity X
by Daniel Payne on 10-22-2024 at 10:00 am
Categories: Cadence, EDA

Sigrity X

Signal Integrity (SI) and Power Integrity (PI) issues are critical to analyze, ensuring the proper operation of PCB systems and IC packages, yet the computational demands from EDA tools can cause engineers to only analyze what they deem are critical signals, instead of the entire system. Cadence has managed to overcome this SI/PI… Read More

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Advanced Audio Tightens Integration to Implementation

Advanced Audio Tightens Integration to Implementation
by Bernard Murphy on 10-22-2024 at 6:00 am
Categories: AI, Cadence, EDA

girl wearing wireless earbuds on noisy street min

You might think that in the sensing world all the action is in imaging and audio is a backwater. While imaging features continue to evolve, audio innovations may be accelerating even faster to serve multiple emerging demands: active noise cancellation, projecting a sound stage from multiple speakers, 3D audio and ambisonics,… Read More