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The meaning of the word “Veloce” is “blazing fast”. It is the inspiration behind the name of the Ansys VeloceRF electromagnetic (EM) passive device synthesis platform that has been a favorite among RF and high-speed integrated circuit (IC) designers for more than 15 years. VeloceRF is a name that designers automatically connect… Read More
Data communication speeds continue to grow. New encoding schemes, such as PAM-4 are helping achieve faster throughput. Compared to the traditional NRZ scheme, PAM4 can send twice the signal by using four levels vs. the two used in NRZ. The diagram at the top of this post shows the how data density is increased. With progress comes… Read More
We are in the semiconductor market phase where everybody disagrees on what is going on. The market is up; the market is down. Mobile phones are up…. oh no, now they are down. The PC market is up—oh no, we need to wait until we can get an AI PC. The inflation is high—the consumer is not buying.
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Time-sensitive networking for aerospace and defense applications is receiving new attention as a new crop of standards and profiles approaches formal release, anticipated before the end of 2024. CAST, partnering with Fraunhofer IPMS, has developed a suite of configurable IP for time-sensitive networking (TSN) applications,… Read More
The recent TSMC Technology Symposium in the Bay Area showcased the company’s leadership in areas such as solution platforms, advanced and specialty technologies, 3D enablement and manufacturing excellence. As always, the TSMC ecosystem was an important part of the story as well and that topic is the subject of this post. Analog… Read More
The latest significant development in EUV lithography technology is the arrival of High-NA systems. Theoretically, by increasing the numerical aperture, or NA, from 0.33 to 0.55, the absolute minimum half-pitch is reduced by 40%, from 10 nm to 6 nm. However, for EUV systems, we need to recognize that the EUV light (consisting … Read More
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