In a move poised to accelerate the integration of open-source processor architectures into resource-constrained devices, semiconductor IP provider CAST, Inc. unveiled its Catalyst™ Program at the RISC-V Summit in Santa Clara, California. This initiative addresses a persistent pain point for embedded system developers:… Read More
Accellera Strengthens Industry Collaboration and Standards Leadership at DVCon U.S. 2026At DVCon U.S. 2026, Accellera Systems Initiative reinforces…Read More
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected HomeThe rapid expansion of IoT, smart home, and…Read More
Why PDF Solutions Is Positioning Itself at the Center of the Semiconductor EcosystemThe semiconductor industry is on track to exceed…Read More
Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026The semiconductor industry’s transition toward chiplet-based architectures is…Read MorePodcast EP313: How proteanTecs Optimizes Production Test
Daniel is joined by Alex Burlak is Vice President of Test & Analytics at proteanTecs. With combined expertise in production testing and data analytics of ICs and system products, Alex joined proteanTecs in October, 2018. Before joining the company, Alex held a Senior Director of Interconnect and Silicon Photonics Product… Read More
CEO Interview with Alex Demkov of La Luce Cristallina
Alex Demkov is co-founder and CEO of La Luce Cristallina. He is a distinguished figure in the field of materials physics, serving as a Professor at the University of Texas at Austin. With a prolific career marked by notable achievements, Alex boasts an impressive portfolio of 10 U.S. patents and many patent applications, showcasing… Read More
IPLM Today and Tomorrow from Perforce
Today, Perforce IPLM stands at the intersection of data management, automation, and collaboration, shaping the way companies design the next generation of chips and systems. Looking ahead, its evolution will reflect the growing convergence of hardware, software, and AI-driven engineering.
Chiplets: Powering the Next Generation of AI Systems
AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More
Better Automatic Generation of Documentation from RTL Code
One technical topic I always find intriguing is the availability of links between documentation and chip design. It used to be simple: there weren’t any. Architects wrote a specification (spec) in text, in Word if they had PCs, or using “troff” or a similar format if they were limited to Unix platforms. Then the hardware designers… Read More
FD-SOI: A Cyber-Resilient Substrate for Secure Automotive Electronics
The paper highlights how Fully Depleted Silicon-On-Insulator (FD-SOI) technology provides a robust defense against Laser Fault Injection (LFI), a precise, laboratory-grade attack method that can compromise cryptographic and safety-critical hardware. As vehicles become increasingly digital and connected, with dozens… Read More
Podcast EP312: Approaches to Advance the Use of Non-Volatile Embedded Memory with Dave Eggleston
Daniel is joined by Dave Eggleston is senior business development manager at Microchip with a focus on licensing SST SuperFlash technology. Dave’s extensive background in Flash, MRAM, RRAM, and storage is built on 30+ years of industry experience. This includes serving as VP of Embedded Memory at GLOBALFOUNDRIES, CEO… Read More
Learning from In-House Datasets
At a DAC Accellera panel this year there was some discussion on cross-company collaboration in training. The theory is that more collaboration would mean a larger training set and therefore higher accuracy in GenAI (for example in RTL generation). But semiconductor companies are very protective of their data and reports of copyrighted… Read More
Liberty IP Excellence: Building a Robust Verification Framework for Automotive IPs
As 2025 draws to a close, the semiconductor industry continues to push boundaries, particularly in automotive applications where reliability is non-negotiable. At the TSMC Open Innovation Platform forum this year, a collaborative presentation by NXP Semiconductors and Siemens EDA stood out: “Liberty IP Excellence:… Read More



TSMC vs Intel Foundry vs Samsung Foundry 2026