Synopsys IP Designs Edge AI 800x100

Revolutionizing AI Infrastructure: Alchip and Ayar Labs’ Co-Packaged Optics Breakthrough at TSMC OIP 2025

Revolutionizing AI Infrastructure: Alchip and Ayar Labs’ Co-Packaged Optics Breakthrough at TSMC OIP 2025
by Daniel Nenni on 10-01-2025 at 6:00 am

Alchip TSMC OIP 2025

In the relentless race to power next-generation artificial intelligence (AI) systems, data connectivity has emerged as the critical bottleneck. As AI models balloon in size—from billions to trillions of parameters—compute resources alone are insufficient. According to Ayar Labs, approximately 70% of AI compute time is … Read More


AI Everywhere in the Chip Lifecycle: Synopsys at AI Infra Summit 2025

AI Everywhere in the Chip Lifecycle: Synopsys at AI Infra Summit 2025
by Kalar Rajendiran on 09-30-2025 at 10:00 am

Godwin Talk Summary AI Infra Summit 2025

At the AI Infra Summit 2025, Synopsys showed how artificial intelligence has become inseparable from the process of creating advanced silicon. The company’s message was clear: AI is an end-to-end engine that drives every phase of chip development. Three Synopsys leaders illustrated this from distinct vantage points. Godwin… Read More


Neurosymbolic code generation. Innovation in Verification

Neurosymbolic code generation. Innovation in Verification
by Bernard Murphy on 09-30-2025 at 6:00 am

Innovation New

Early last year we talked about state space models, a recent advance over large language modeling with some appealing advantages. In this blog we introduce neurosymbolic methods, another advance in foundation technologies, here applied to automated code generation. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano… Read More


Analog Bits Steps into the Spotlight at TSMC OIP

Analog Bits Steps into the Spotlight at TSMC OIP
by Mike Gianfagna on 09-29-2025 at 10:00 am

Analog Bits Steps into the Spotlight at TSMC OIP

The TSMC Open Innovation Platform (OIP) Ecosystem Forum kicked off on September 24 in Santa Clara, CA. This is the event where TSMC recognizes and promotes the vast ecosystem the company has created. After watching this effort grow over the years, I feel that there is nothing the group can’t accomplish thanks to the alignment and… Read More


Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions

Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
by Daniel Nenni on 09-29-2025 at 6:00 am

synopsys tsmc oip 2025 leading the next wave of ai and multi die innovation for tsmc advanced node designs

Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More


Via Multipatterning Regardless of Wavelength as High-NA EUV Lithography Becomes Too Stochastic

Via Multipatterning Regardless of Wavelength as High-NA EUV Lithography Becomes Too Stochastic
by Fred Chen on 09-28-2025 at 10:00 am

Fred Chen EUV 2025

For the so-called “2nm” node or beyond, the minimum metal pitch is expected to be 20 nm or even less, while at the same time, contacted gate pitch is being pushed to 40 nm [1]. Therefore, we expect via connections that can possibly be as narrow as 10 nm (Figure 1)! For this reason, it is natural to expect High-NA EUV lithography as the go-to

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CEO Interview with Jiadi Zhu of CDimension 

CEO Interview with Jiadi Zhu of CDimension 
by Daniel Nenni on 09-28-2025 at 8:00 am

Jiadi headshot

Jiadi Zhu is the CEO and founder of CDimension, a company rethinking chip design to shape the next generation of computing. Under his leadership, CDimension is creating the next generation of building blocks for chips, starting with materials and scaling up to full systems that can power everything from today’s AI and advanced… Read More


Podcast EP308: How Clockwork Optimizes AI Clusters with Dan Zheng

Podcast EP308: How Clockwork Optimizes AI Clusters with Dan Zheng
by Daniel Nenni on 09-26-2025 at 10:00 am

Daniel is joined by Dan Zheng, VP of Partnerships and Operations at Clockwork. Dan was the General Manager for Product and Partnerships at Urban Engines which was acquired by Google in 2016. He has also held roles at Stanford University and Google.

Dan explores the challenges of operating massive AI hardware infrastructure at … Read More


CEO Interview with Howard Pakosh of TekStart

CEO Interview with Howard Pakosh of TekStart
by Daniel Nenni on 09-26-2025 at 6:00 am

!HP biopic 2

Howard Pakosh is a serial entrepreneur and angel investor. Mr. Pakosh is also Founder & CEO of the TekStart Group, a Toronto-based boutique incubator focusing on Fractional-C business development support, as well as developing, promoting and licensing technology into markets such as blockchain, Internet-of-Things… Read More


SkyWater Technology Update 2025

SkyWater Technology Update 2025
by Daniel Nenni on 09-25-2025 at 10:00 am

Skywater Technologies HQ

SkyWater Technology, a U.S. based pure-play semiconductor foundry, has made significant strides in 2025 reinforcing its position as a leader in domestic semiconductor manufacturing. Headquartered in Bloomington, Minnesota, SkyWater specializes in advanced innovation engineering and high volume manufacturing of differentiated… Read More