AI is exploding everywhere. We’ve all seen the evidence. The same thing is happening with AI conferences. The conference I will discuss here began in 2018 as the AI Hardware Summit. The initial venue was the Computer History Museum in Mountain View, CA. Like most things AI, this conference has grown substantially in a relatively… Read More
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The Chips R&D Program Seeks to Accelerate Innovation
The CHIPS and Science Act has allocated $11 billion for semiconductor R&D, including for advanced packaging and AI-driven design. Companies should apply now.
In 2022, the United States signed the $50 billion Chips and Science Act. Under the act, the National Institute of Standards and Technology (NIST), which is part of … Read More
Tier1 Eye on Expanding Role in Automotive AI
The unsettled realities of modern automotive markets (BEV/HEV, ADAS/AD, radical views on how to make money) don’t only affect automakers. These disruptions also ripple down the supply chain prompting a game of musical chairs, each supplier aiming to maximize their chances of still having a chair (and a bigger chair) when the … Read More
Signal Integrity Basics
PCB and package designers need to be concerned with Signal Integrity (SI) issues to deliver electronic systems that work reliably in the field. EDA vendors like Siemens have helped engineers with SI analysis using a simulator called HyperLynx, dating all the way back to 1992. Siemens even wrote a 56-page e-book recently, Signal… Read More
My Conversation with Infinisim – Why Good Enough Isn’t Enough
My recent post on a high-profile chip performance issue got me thinking. The root cause of the problem discussed there had to do with a clock tree circuit that was particularly vulnerable to reliability aging under elevated voltage and temperature. Chip aging effects have always got my attention. I’ve lived through a few of them… Read More
Build a 100% Python-based Design environment for Large SoC Designs
In the fast-evolving world of semiconductor design, chip designers are constantly on the lookout for EDA tools that can enhance their productivity, streamline workflows, and push the boundaries of innovation. Although Tcl is currently the most widely used language, it seems to be reaching its limits in the face of the growing… Read More
Keysight EDA 2025 launches AI-enhanced design workflows
The upcoming Keysight EDA 2025 launch has three familiar tracks: RF circuit design, high-speed digital circuit design, and device modeling and characterization. However, this update features a common thread between the tracks – AI-enhanced design workflows. AI speeds modeling and simulation, opening co-optimization for… Read More
Podcast EP260: How Ceva Enables a Broad Range of Smart Edge Applications with Chad Lucien
Dan is joined by Chad Lucien, vice president and general manager of Ceva’s Sensing and Audio Business Unit. Previously he was president of Hillcrest Labs, a sensor fusion software and systems company, which was acquired by Ceva in July 2019. He brings nearly 25 years of experience having held a wide range of roles with software, … Read More
CEO Interview: Bijan Kiani of Mach42
Bijan’s role includes overseeing all product groups, field engineering, customer support, strategy, sales, marketing, and business development. His previous appointments include VP of Marketing at Synopsys Design Group and CEO of InCA. He holds a PhD in Electrical Engineering.
Tell us about your company
Mach42 is a verification… Read More
Changing RISC-V Verification Requirements, Standardization, Infrastructure
A lively panel discussion about RISC-V and open-source functional verification highlighted this year’s Design Automation Conference. Part One looked at selecting a RISC-V IP block from a third-party vendor and investigating its functional verification process.
In Part Two, moderator Ron Wilson and Contributing Editor … Read More
Rethinking Multipatterning for 2nm Node