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Senior Manager R&D Packaging & Assembly

Senior Manager R&D Packaging & Assembly
by Admin on 07-03-2024 at 2:28 pm

Website Pragmatic

Overview

The R&D Packaging & Assembly Senior Manager will be responsible for day-to-day activities of the R&D assembly team, part of the R&D group, and deliver on the organization roadmap for future FlexIC assembly technologies, working closely with other teams in R&D, Technology, Operations as well as external development partners.

Key tasks

  • Lead and manage a team of engineers and technicians responsible for FlexIC packaging and assembly development activities.
  • Drive package integration efforts, package and enabling technology development for new FlexIC products and technologies.
  • Set and document package specifications, design rules, and assembly process requirements for outsourced semiconductor assembly and test (OSAT) partners.
  • Collaborate with cross-functional teams, including design engineers, process engineers, and customers, to enable successful assembly development and integration.
  • Provide technical leadership and expertise in FlexIC packaging and assembly processes, materials, and technologies.
  • Develop, review, and approve standard operating procedures (SOPs) and other documentation for packaging processes and equipment.
  • Support investigation of assembly process issues, identify and implement process improvements, and drive continuous improvement initiatives.

Qualifications and training

  • Degree or post-graduate in electronics, mechanical engineering, electronics engineering, MEMS or another relevant discipline; or equivalent experience.
  • In depth knowledge of semiconductor packaging and assembly technologies.

Skills and experience

  • Experience with semiconductor packaging techniques including electroplating, redistribution layers, wafer bumping, etc.
  • Experience with semiconductor, MEMs and flexible electronics assembly techniques including direct die attach, flip chip, thermo bonding, solder, wire bonding, etc.
  • Proficiency in package design, development, and integration for new semiconductor products.
  • Ability to set package specifications, design rules, and assembly process requirements.
  • Excellent project management skills to lead cross-functional teams and drive successful assembly development.
  • Expertise in developing and reviewing standard operating procedures (SOPs) and documentation.
  • Familiarity with packaging equipment, facilities, and process qualification.
  • Strong problem-solving and continuous improvement mindset.
  • Effective communication and leadership skills to manage teams and collaborate with internal and external stakeholders.
  • Team leading/management experience is desired although not essential.
Apply for job

To view the job application please visit talent.pragmaticsemi.com.

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