Project Manager

Job Description: Interface with key customers to identify and fulfill customers’ semiconductor packaging technology needs. Direct customers to the right packaging solutions and work with TSMC headquarters to deliver solutions to meet customers’ product needs. Support advanced flip chip, wafer level package, bumping, Si & RDL interposer, and 3DIC technologies to customers. Coordinate with account teams to provide technical justification for customer requests. Influence TSMC headquarters packaging technology development and business directions through customer interactions. Support pre-sale and post-sale advanced packaging technologies related activities to customers. Research industry trend of advanced backend technology in mobile and high-speed computing segments and provide market intelligence to TSMC headquarters.

Requirements: Master’s degree or foreign equivalent in Mechanical Engineering, Materials Science and Engineering, or Electrical Engineering, and two (2) years of experience in a related position.

Work experience must have included: Experience with advanced packaging technologies, including 2.5D, 3D, 3.5D packaging technology, fan-out packages, flip-chip, BGA, WLCSP packages and heterogeneous packages; Knowledge of chip-packaging interaction, assembly processes, thermo-mechanical-electrical behavior of packages and its materials, advanced material electrical/mechanical performance requirements on packages, and reliability tests; Experience with thermo-mechanical simulation/modeling, packaging thermal characteristics/thermal dissipation mechanism, electrical SI/PI design principles and simulation, or packaging design flow and EDA; and Experience in program/project management.

Work site: TSMC North America, 2851 Junction Avenue, San Jose, CA 95134

Salary range:  $117,645 to $182,185 per year

Company Description  

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

• The world’s leading dedicated semiconductor foundry
• The technology leader with a strong reputation for manufacturing excellence
• Advancing semiconductor manufacturing innovations to enable the future of technology