Mask New Material Research and Development Engineer
Website TSMC
Description
1. New EUV mask material development, including material design, film deposition, and characterization
2. New e-beam photoresist material development for EUV mask patterning
2. New e-beam photoresist material development for EUV mask patterning
Qualifications
1. Master’s degree or above and major in Materials Science, Physics, Optics, Chemistry or Chemical Engineering
2. Clear mind and logical thinking, positive and aggressive attitude
3. Good communication skills and a team player, fluent in English
4. Skilled or experienced in thin-film sputter process and characterization is preferred.
5. Skilled or experienced in photoresist synthesis and exposure pattern evaluation is preferred.
2. Clear mind and logical thinking, positive and aggressive attitude
3. Good communication skills and a team player, fluent in English
4. Skilled or experienced in thin-film sputter process and characterization is preferred.
5. Skilled or experienced in photoresist synthesis and exposure pattern evaluation is preferred.
Real men have fabs!