August 23, 2021 By Rubin Gonsalves
Rapidly-growing AI system capabilities are driving new product architectures that demand increased speeds, bandwidths, frequencies and densities. Scalability and configurability are a must. In embedded applications, many AI systems leverage the ease of design and economies of scale of systems-on-modules (SoMs).
System-on-modules are an example of make or buy system design. A SoM includes the system compute engine (MCU, FPGA, GPU, etc.) as well as general support circuitry like DRAM, power and expansion connectors. SoMs typically attached application-specific carrier cards via high-performance expansion connectors.
SoMs offer many advantages to discrete, chip-down designs. This includes faster time to market, reduced development costs and a scalable product range. Plus, OEMs using SoMs can focus on key system features instead of a complex, digital chip down design.
Xilinx Kria Adaptive System-on-Module
FPGA and SoC-based SoMs are becoming more popular, especially for AI-focused applications. Xilinx Kria Adaptive SoMs offer unmatched AI performance via pre-built hardware and software. Kria is a compact embedded platform that integrates a custom built Zynq® UltraScale+™ MPSoC that runs optimally (and exclusively) on the SOM with DDR memory, nonvolatile storage devices, a security module, and an aluminum thermal heat spreader.
The SOM is designed to be plugged into a carrier card with solution-specific peripherals. Kria is offered in commercial and industrial temperatures ranges. Key target applications include smart city, machine vision, industrial robotics, and AI/ML computing.
Kria Expansion Connectors
Kria SoMs feature a pair AcceleRate HD Ultra-Dense Slim Body Arrays. The 240-pin connectors provide electrical connectivity between the SOM and the carrier card. These two connectors are referred to as SOM240_1 and SOM240_2. An AcceleRate HD socket (ADF6–60–03.5–L–4–2–A) is used on the bottom side of the SOM. An AcceleRate HD terminal (ADM6–60–01.5–L–4–2–A) is for use on the carrier card.
The SOM240_1 and SOM240_2 connectors provide support for following interfaces:
AcceleRate HD Ultra-Dense Slim Body Arrays
AcceleRate HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications. The surface of the contact is milled, creating a smooth mating surface which reduces wear on the contact. This increases durability and cycle life. Also, lower insertion and withdrawal forces allow zippered mating and unmating.
Key features include:
Rapidly-growing AI system capabilities are driving new product architectures that demand increased speeds, bandwidths, frequencies and densities. Scalability and configurability are a must. In embedded applications, many AI systems leverage the ease of design and economies of scale of systems-on-modules (SoMs).
System-on-modules are an example of make or buy system design. A SoM includes the system compute engine (MCU, FPGA, GPU, etc.) as well as general support circuitry like DRAM, power and expansion connectors. SoMs typically attached application-specific carrier cards via high-performance expansion connectors.
SoMs offer many advantages to discrete, chip-down designs. This includes faster time to market, reduced development costs and a scalable product range. Plus, OEMs using SoMs can focus on key system features instead of a complex, digital chip down design.
Xilinx Kria Adaptive System-on-Module
FPGA and SoC-based SoMs are becoming more popular, especially for AI-focused applications. Xilinx Kria Adaptive SoMs offer unmatched AI performance via pre-built hardware and software. Kria is a compact embedded platform that integrates a custom built Zynq® UltraScale+™ MPSoC that runs optimally (and exclusively) on the SOM with DDR memory, nonvolatile storage devices, a security module, and an aluminum thermal heat spreader.
The SOM is designed to be plugged into a carrier card with solution-specific peripherals. Kria is offered in commercial and industrial temperatures ranges. Key target applications include smart city, machine vision, industrial robotics, and AI/ML computing.
Kria Expansion Connectors
Kria SoMs feature a pair AcceleRate HD Ultra-Dense Slim Body Arrays. The 240-pin connectors provide electrical connectivity between the SOM and the carrier card. These two connectors are referred to as SOM240_1 and SOM240_2. An AcceleRate HD socket (ADF6–60–03.5–L–4–2–A) is used on the bottom side of the SOM. An AcceleRate HD terminal (ADM6–60–01.5–L–4–2–A) is for use on the carrier card.
The SOM240_1 and SOM240_2 connectors provide support for following interfaces:
- Control and status signals
- Multiplexed I/O (MIO) bank
- PS-GTR high-speed serial transceiver signals
- High-performance I/O (HPIO) bank signals
- High-density I/O (HDIO) bank signals
- GTH high-speed serial transceiver signals
- Power system
AcceleRate HD Ultra-Dense Slim Body Arrays
AcceleRate HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications. The surface of the contact is milled, creating a smooth mating surface which reduces wear on the contact. This increases durability and cycle life. Also, lower insertion and withdrawal forces allow zippered mating and unmating.
Key features include:
- Incredibly dense with up to 240 total I/Os; up to 400 in development
- Low profile 5 mm stack height
- Slim 5 mm width
- 4-row design; 10 – 60 positions per row (70 – 100 total positions per row in development)
- Edge Rate® contact system optimized for signal integrity performance
- Open-pin-field design for grounding and routing flexibility
- Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
- PCIe® GEN 5 compatible
- Solder ball technology for simplified processing and self aligning
- 7 – 16 mm stack heights, right-angle and cable in development