They certainly have the room for it. Or will TSMC stick with partner Amkor Technology, which plans to construct an advanced packaging and testing facility in Peoria, Arizona. The Amkor facility will focus on advanced packaging technologies, including TSMC based fan-out wafer-level packaging and 3D packaging techniques.
Also, Arizona State University has been selected to host a flagship prototyping and advanced packaging research and development facility. This initiative will combine 300mm research and prototyping for front-end manufacturing with packaging capabilities, addressing a unique need within the U.S. semiconductor ecosystem.
Also, Arizona State University has been selected to host a flagship prototyping and advanced packaging research and development facility. This initiative will combine 300mm research and prototyping for front-end manufacturing with packaging capabilities, addressing a unique need within the U.S. semiconductor ecosystem.
Arizona and ASU Selected For Flagship Prototyping and Advanced Packaging R&D Facility
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