TSMC's subsidiary, Japan Advanced Semiconductor Manufacturing (JASM), is proceeding with plans to construct a second wafer fabrication plant in Kumamoto, Japan. While construction is slated to commence in 2025, there is a possibility of a delay beyond the initially planned first quarter. Despite this potential postponement, JASM maintains its target to begin production by the end of 2027.
The first JASM fab in Kumamoto began mass production in December 2024, focusing on 12/16nm and 22/28nm process technologies for applications in consumer electronics, automotive, industrial, and high-performance computing sectors.
In contrast, TSMC's expansion efforts in Arizona have faced delays. The second Arizona chip plant, initially expected to commence production in 2026, has been postponed to 2027 or 2028 due to labor and licensing challenges.
TSMC's global expansion strategy includes plans for a third facility in Arizona, projected to produce chips using 2nm or more advanced processes, with production beginning by the end of the decade.
These developments underscore TSMC's commitment to enhancing its global manufacturing footprint, despite facing challenges in different regions.
[TSMC's Second Wafer Plant in Kumamoto May Face Construction Delays, | SMM
[TSMC's Second Wafer Plant in Kumamoto May Face Construction Delays, Still Scheduled for 2027 Production] TSMC's second wafer plant in Japan may
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