HBM is still dominated by the three major manufacturers: SK Hynix, Samsung and Micron. Among them, SK Hynix accounts for 50% of the global market, far ahead of other major manufacturers. Reuters
SK Hynix, the world's third largest memory manufacturer , has made new progress in its cooperation with TSMC , the leading wafer foundry . Foreign media reports indicate that SK Hynix will cooperate with TSMC to develop sixth-generation high-bandwidth memory (HBM), competing for market share. The huge market established by the growth of AI (artificial intelligence).
Research organization Omdia pointed out that in the third quarter of 2023, SK Hynix’s market share in the DRAM field reached 35%, overtaking Samsung, mainly because it benefited from being installed in high-end AI servers. The surge in demand for HBM and the high entry barriers to HBM have given SK Hynix a "winner-take-all" advantage.
Korean media pointed out that Hynix has formed a strategic alliance called "One Team" with TSMC to cooperate in the development of sixth-generation high-bandwidth memory. The goal of this strategic alliance is to bring together the two companies' expertise in new-generation AI semiconductor packaging . Technical expertise will consolidate both parties’ positions in the AI chip market.
A spokesman for SK Hynix said that it could not confirm any details related to its partners; TSMC had not yet received a response from the company before the deadline of this newspaper yesterday.
The industry pointed out that ten years ago, when TSMC was laying out 3D IC technology, it incorporated sealing and testing technology and proposed CoWoS one-time purchase service. At that time, TSMC cooperated with SK Hynix on memory chips. Now the two giants are targeting In the field of AI, we will make every effort to strengthen our capabilities in this field.
Korean media reports further stated that as generative AI becomes increasingly popular, SK Hynix has become a strong participant in the HBM market, while TSMC is the world's largest semiconductor foundry. Both companies are strengthening their influence in the AI chip market. At the same time, this AI semiconductor alliance is also seen as forming a common front to fight against Samsung Electronics .
Regarding the development of AI, in a previous press conference, TSMC President Wei Zhejia estimated that the compound annual growth rate of AI revenue driven by HPC (high performance computing) in the next few years will be as high as 50%. This data is not yet available. Including the edge device side, it is estimated that AI-related revenue will account for about 17 to 19% of TSMC's overall revenue in 2027. It is optimistic that in addition to AI processors, including Netcom, mobile phones and PCs, it will be gradually introduced, and it is recommended that The semiconductor content of various types of terminal devices has increased.
The industry believes that SK Hynix is ahead of its peers in HBM technology and recently announced that it will launch the fifth generation of high-bandwidth memory in the first half of 2024. TSMC's industrial status is also ahead of the curve. The two giants will be able to accelerate technological progress by joining forces. Seize an excellent fighting position in the AI market.
