TSMC today held a 2 nanometer (2nm) Capacity Expansion Ceremony at the construction site of Fab
22 in the Southern Taiwan Science Park (STSP), bringing together representatives from government
as well as construction and supplier partners to mark an important milestone in the expansion of the
company's advanced process capacity.
TSMC is developing its advanced process technology and installing capacity in Taiwan. The
Company's 2nm process technology is slated to enter volume production in the second half of 2025,
with its expansion plan progressing smoothly. Located in Kaohsiung, TSMC's Fab 22 is a key facility
for 2nm capacity. Today, the Company held a topping ceremony for the second phase of the fab.
The fab plan for TSMC Fab 22 has set each phase cleanroom to be twice the size of a standard logic
wafer fab, with a total cleanroom area of 280,000 square meters from phase 1 to phase 5. The entire
site is expected to create over 20,000 construction jobs and more than 7,000 direct high-tech positions.
Alongside the expansion of 2nm capacity at the Southern Taiwan Science Park, its deployment at
Hsinchu Science Park is also progressing as planned.
TSMC Executive Vice President and Co-Chief Operating Officer Y.P. Chyn presided over today’s
ceremony, and honored guests at the event included Premier Cho Jung-tai, Kaohsiung City Mayor
Chen Chi-mai, Executive Yuan Secretary-General Kung Ming-hsin, Minister of Economic Affairs
Kuo Jyh-huei, Vice Minister of Science and Technology Su Chen-kang, Fu Tsu Construction
Chairman Cliff Lin, Dacin Construction Chairman Wang Jen-jeng, China Steel Corporation Chairman
Chen Jui-Teng, Tung Ho Steel Chairman Henry C. T. Ho, Evergreen Steel Chairman Lin Keng-li,
United Integrated Services Chairman Lee Hui-Wen, Marketech International Chairman Margaret Kao,
and representatives from construction partners as well as materials and equipment suppliers.
"We thank our colleagues, contractors, suppliers, and government for their long-standing support.
Today's 2nm capacity expansion ceremony holds significant importance for global semiconductor
technology development, marking the successful progress of TSMC's world-leading 2nm process,”
TSMC Executive Vice President and Co-Chief Operating Officer Y.P. Chyn said at the ceremony. “It
showcases TSMC's commitment to meeting strong market demand, continuously expanding capacity
to support customers. TSMC will keep strengthening its global presence, providing customers with
the best technology solutions and manufacturing services to drive technology forwards. Together with
our stakeholders, we aim to create more industry milestones, realizing a more innovative and
sustainable future."
Fab 22 embodies TSMC’s commitment to green manufacturing and environmental harmony. Like all
TSMC GIGAFAB® facilities in Taiwan, the fab is designed and constructed according to the Taiwan
EEWH and U.S. LEED green building certification standards. Fab 22 also plans to actively utilize
reclaimed water, drawing water resources from the Nanzih and Qiaotou Reclaimed Water Plants.
Additionally, it will use 25% renewable energy from the beginning of volume production, aiming to
reach 100% renewable energy usage by 2040 and achieve net-zero emissions by 2050.
The development of TSMC’s 2nm technology is proceeding as planned with good progress.
Compared with the previous generation’s enhanced N3E technology, TSMC’s 2nm-class N2
technology offers a 10-15% increase in speed at the same power consumption or 25-30% reduction
in power consumption at the same speed. When launched, N2 will be the industry’s most advanced
logic technology in terms of power, performance, area, and transistor structure. With its
manufacturing excellence, TSMC consistently provides customers with the highest quality and
reliability, empowering them to unleash innovations in the end market.
TSMC's 2nm Technology Progress and Capacity Development
• The development of TSMC’s 2nm technology is proceeding as planned with good progress,
with 2nm technology slated to enter volume production in the second half of 2025. Through
TSMC’s manufacturing excellence, the Company ensures that it can provide customers with
optimal and consistent quality and reliability. TSMC’s 2nm process is expected to be the most
advanced semiconductor technology in power, performance, and area (PPA) as well as
transistor technology when it enters production.
• In response to strong market demand for advanced logic processes and packaging
technologies, TSMC is closely collaborating with customers to plan capacity. TSMC is
currently planning to produce its 2nm process technology at two locations in Taiwan: Fab 20,
situated in the Hsinchu Science Park, and Fab 22, located in the Kaohsiung Science Park, part
of the Southern Taiwan Science Park.
Market Impact of TSMC's 2nm Technology
• TSMC expects the number of 2nm product tape-outs within the first two years will surpass
that of 3nm process during the same period.
• 2nm process technology is expected to be widely applied in customers' next-generation
leading technology products, including supercomputers, mobile devices, and cloud data
centers, addressing robust global demand for energy-efficient computing.
• TSMC estimates that 2nm technology will create end products with a market value of US$2
trillion within five years of volume production.
TSMC's 2nm Fab Construction Timeline
• Nov 2019 Initiated Fab 20 construction plan with support from the Hsinchu Science Park
Bureau and Hsinchu County Government.
• Jun 2022 Initiated Fab 22 construction plan with support from Southern Taiwan Science Park
Bureau and Kaohsiung City Government.
• Oct 2022 Construction begins on Fab 20 and Fab 22
• Mar 2024 Fab 20 Phase 1 begins tool installation
• Nov 2024 Fab 22 Phase 1 begins tool installation
• Mar 2025 Fab 22 Phase 2 topping ceremony
• 2H2025 2nm technology scheduled to enter volume production
Southern Taiwan (Nanzih) Science Park TSMC Kaohsiung Facility
• TSMC's other fabs in the Southern Taiwan Science Park, including those for 5nm and 3nm
processes, collectively contribute to the formation of the world's largest semiconductor
manufacturing service cluster.
• Five phases are currently planned for the facility, with progress on schedule: the first phase is
currently installing tools; the second phase has completed structural engineering following
today's topping ceremony; the third phase has commenced structural engineering work; and
the fourth and fifth phases passed environmental impact assessments in March. TSMC's
Kaohsiung Fab spans approximately 79 hectares. Cleanroom area for Phases 1 through 5 are
each approximately double the size of a standard logic fab, totaling 280,000 square meters,
equivalent to more than 46 standard football fields.
• The combined development of TSMC's Kaohsiung facility creates over 20,000 construction
jobs and more than 7,000 direct high-tech job opportunities.
Southern Taiwan (Nanzih) Science Park TSMC Kaohsiung Facility: Culture, Sustainability,
and Green Manufacturing
• To realize green manufacturing and environmental harmony. The facility plans to utilize water
resources from the Nanzih and Qiaotou Reclaimed Water Plants, actively adopting reclaimed
water.
• From the start of mass production, the Kaohsiung facility will use 25% renewable energy,
progressively working towards the sustainability targets of 100% renewable energy by 2040
and net-zero emissions by 2050.
• The architectural facade of the Kaohsiung facility draws inspiration from ink paintings,
reflecting the image of Kaohsiung's Banpingshan Mountain, visually connecting with the
neighboring mountain as a tribute to the local landscape.
• The facility is designed with an ecological park concept, forming a "Green Axis and Blue
Point" in the Greater Nanzih area. The Green Axis begins with the Banpingshan ecosystem,
extending into the green space of the Kaohsiung facility and the surrounding community. A
continuous arrangement of butterfly- and bird-attracting plants ensures uninterrupted
movement for butterflies and birds.
The Blue Point connects the ecological detention ponds
with the flow of nearby creeks, providing habitats for waterfowl and fostering biodiversity.
By linking various ecological detention ponds around the facility, TSMC creates water spaces
for wildlife to reside, complementing the continuous green space to form a complete and rich
ecological environment.
TSMC Fast Facts
ESG at TSMC
• Green manufacturing is the cornerstone of the company’s sustainable operations. TSMC
regularly seeks to find areas of improvement spanning energy management, water
management, waste management, and air pollution control.
• TSMC is the world’s first semiconductor company to join the RE100 renewable energy
initiative.
• TSMC has set a goal of reaching net zero emissions by 2050. To achieve this, TSMC will
continue to set related mitigation measures, strengthen its wide variety of green innovations,
and actively adopt renewable energy. In the short term, The Company has set the goal of zero
emissions growth by 2025 and reducing emissions to year 2020 levels by 2030.
• TSMC publishes an annual Sustainability Report which evaluates critical challenges,
benchmarks against global practices, outlines goals, and proposes plans for improvement.
• TSMC supports cutting-edge research at global universities, including the U.S., to further
innovation
• TSMC is the world’s only semiconductor company to be selected as a component of the Dow
Jones Sustainability Indices (DJSI) for 24 consecutive years.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been
the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s leading process technologies and
portfolio of design enablement solutions to unleash innovation for the global semiconductor industry.
With global operations spanning Asia, Europe, and North America, TSMC serves as a committed
corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522
customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging
technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please
visit https://www.tsmc.com.
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