The 2025 Symposium on VLSI Technology and Circuits is a premiere international conference that records the pace, progress, and evolution of micro/nano integrated electronics, scheduled for June 8-12, 2025. The Symposium will be held in-person at the Rihga Royal Hotel, Kyoto Japan to foster networking opportunities.
The Symposium’s overall theme, " Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth " integrates advanced technology developments, innovative circuit designs, and the applications that they enable as part of our global society’s transition to a new era of smart connected devices, infrastructure and systems that change the way humans interact with each other. The following are some of the highlight papers that address this theme:
Technology Highlights Advanced CMOS Technology “Intel 18A Platform Technology Featuring RibbonFET (GAA) and Power Via for Advanced High-Performance Computing” – Intel (Paper T1-1) An advanced Intel 18A technology featuring RibbonFET and Power Via provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use. Figures：(Left)Intel 18A vs. Intel 3 PPA (Power, Performance, Area) comparison.
PDF: https://www.vlsisymposium.org/wp-content/uploads/EN09_Technical-Tip-Sheet-VLSI-2025_EN_fin-1.pdf
The Symposium’s overall theme, " Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth " integrates advanced technology developments, innovative circuit designs, and the applications that they enable as part of our global society’s transition to a new era of smart connected devices, infrastructure and systems that change the way humans interact with each other. The following are some of the highlight papers that address this theme:
Technology Highlights Advanced CMOS Technology “Intel 18A Platform Technology Featuring RibbonFET (GAA) and Power Via for Advanced High-Performance Computing” – Intel (Paper T1-1) An advanced Intel 18A technology featuring RibbonFET and Power Via provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use. Figures：(Left)Intel 18A vs. Intel 3 PPA (Power, Performance, Area) comparison.
PDF: https://www.vlsisymposium.org/wp-content/uploads/EN09_Technical-Tip-Sheet-VLSI-2025_EN_fin-1.pdf